Semiconductor wafer chuck with built-in standoff for contactless photolithography

• US 4,006,909 A
• Filed: 04/16/1975
• Issued: 02/08/1977
• Est. Priority Date: 04/16/1975
• Status: Expired due to Term

• Current Assignee: RCA Corporation (General Electric Company)
• Original Assignee: RCA Corporation (General Electric Company)
• Inventors: Cestone, Frank J., Ollendorf, Joel
• Primary Examiner(s): Weidenfeld, Gil
• Application Number:
  US05/568,716
• Time in Patent Office: 664 Days
• Field of Search: 279/3, 51/235, 269/21
• US Class Current: 279/3
• CPC Class Codes: B25B 11/005 Vacuum work holders
• CPC Class Codes: Y10T 279/11 Vacuum

Abstract

A semiconductor wafer vacuum chuck used as part of a photographic wafer-alignment machine for performing contactless photolithography has integral spacer means disposed on a substantially planar surface thereof for mechanically maintaining a fixed distance between portions of a wafer positioned adjacent the spacer means and the surface of the wafer chuck, whereby a controlled separation is provided between a surface of the wafer and a photographic mask overlying the surface of the wafer upon the application of a vacuum to the surface of the wafer chuck.

Claims

1. A semiconductor wafer vacuum chuck for providing a controlled separation between a surface of a semiconductor wafer having a small degree of flexibility and a photographic mask overlying said surface upon the application of a vacuum to said chuck comprising:

an element including at least one substantially planar surface for receiving said wafer thereon, said element having means to allow a vacuum to be applied to said planar surface, and

means disposed on said surface of said element for mechanically maintaining a fixed distance between a peripheral portion of said wafer supported on said means and said surface of said element, said means being made of non-resilient material and extending no more than about 0.1 millimeters above said surface, and positioned in a pattern to allow a central portion of said wafer spaced inwardly from said means to be drawn towards said surface of said element upon the application of said vacuum to said surface of said element.

2. A semiconductor wafer vacuum chuck as defined in claim 1 wherein said means disposed on said surface of said element comprises an integral spacer structurally attached to said element.

3. A semiconductor wafer vacuum chuck as defined in claim 2 wherein said spacer comprises a continuous ring disposed along the periphery of said surface of said element.

4. A semiconductor wafer vacuum chuck as defined in claim 2 wherein said spacer comprises a plurality of pins disposed at intervals along the periphery of said surface of said element.

5. A semiconductor wafer vacuum chuck as defined in claim 4 wherein said pins are stainless steel and have a diameter of approximately 0.75 millimeters and a height of approximately 0.02 millimeters above said surface of said element.