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Fixed-super-abrasive tool and method of manufacture thereof

  • US 4,010,583 A
  • Filed: 04/17/1975
  • Issued: 03/08/1977
  • Est. Priority Date: 05/28/1974
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a super-abrasive tool for grinding and polishing purposes and having a curvilinear working surface of predetermined desired conformation comprising the steps of:

  • a. providing a substantially-rigid, non-abrasive backing member having a curved support surface determinative of the curvature of said curvilinear working surface;

    b. disposing adjacent said support surface a substantially-malleable, multi-layered, integrally-formed abrasive wafer of predetermined thickness contour having a substantially smooth surface and an abrasive-containing surface, including a thickness in excess of about 1/32 inch, said abrasive wafer comprisingi. a layer of super-abrasive particles having uniform surfaces and a Knoop Hardness in excess of about 3000 kg/mm2 and interspersed and bound in a powdered metal matrix having malleability-imparting properties and comprising a major proportion of copper and a minor proportion of tin andii. a layer comprising a malleable metal having substantially smooth surfaces and substantially free of said super-abrasive particles,said wafer being formed by subjecting said layer of malleable metal and said layer of super-abrasive particles interspersed in a powdered metal binder to sintering conditions of pressure and temperature for the metals to form said multi-layered integrally-formed abrasive wafer;

    c. causing the substantially smooth surface of said abrasive wafer to conform to said support surface so as to impart said predetermined desired conformation as to the exposed abrasive-containing surface of said abrasive wafer by interposing said wafer between said support surface and an opposed surface conformable to the predetermined desired conformation and thereafter bringing said support surface and said opposed surface towards one another with sufficient force to accomplish such conformation;

    d. releasably securing the conformed wafer of (c) to said backing member.

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