Heat sink with parallel flat faces
First Claim
1. Unitary heat sink apparatus comprising a substantially cylindrical body of thermally conductive material having a pair of mutually opposed substantially flat members extending radially outwardly from said cylindrical body, the opposed faces of said radially extending members being resiliently urged into mutual contact by the substantially cylindrical body, each of said opposed faces having a notch therein, said notches lying in register and defining an open-ended space for receiving the body of a semiconductor encapsulation device having a central body with leads extending from one end of said body and a thermal conductor tab extending from the opposite end of said body when said thermal conductor tab is grippingly held between said opposed faces, the sides of said flat members defining said notches extending along opposite sides of said central body to retain said central body within said notches and to act as fins extending into the surrounding environment, at least one of said flat members having the edge thereof at the base of said notch flared outwardly from the opposed flat member.
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Abstract
Disclosed is a unitary heat sink apparatus for dissipating thermal energy generated by semiconductor devices encapsulated in an encapsulation device of the JEDEC TO-202 or Motorola Case 152 device case style. The heat sink is a unitary sheet metal device folded to form two opposed end plates joined by a central barrel portion which acts as a spring to urge the opposed faces of the end plates together. The thermal conductor tab extending from the encapsulation device is held between the opposed faces of the end plates.
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Citations
7 Claims
- 1. Unitary heat sink apparatus comprising a substantially cylindrical body of thermally conductive material having a pair of mutually opposed substantially flat members extending radially outwardly from said cylindrical body, the opposed faces of said radially extending members being resiliently urged into mutual contact by the substantially cylindrical body, each of said opposed faces having a notch therein, said notches lying in register and defining an open-ended space for receiving the body of a semiconductor encapsulation device having a central body with leads extending from one end of said body and a thermal conductor tab extending from the opposite end of said body when said thermal conductor tab is grippingly held between said opposed faces, the sides of said flat members defining said notches extending along opposite sides of said central body to retain said central body within said notches and to act as fins extending into the surrounding environment, at least one of said flat members having the edge thereof at the base of said notch flared outwardly from the opposed flat member.
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4. In combination, a semiconductor encapsulation device having a central body, leads extending from one end of said central body, and a thermal conductor tab extending from the opposite end of said central body;
- and unitary heat sink apparatus comprising a substantially cylindrical body of thermally conductive material having a pair of mutually opposed substantially flat members extending radially outwardly from said cylindrical body, the opposed faces of said radially extending members having a notch therein lying in register with the other notch, the opposed faces of the bases of said notches being adjacent opposite sides of said thermal conductor tab and being resiliently urged toward each other and into intimate contact with said thermal conductor tab by the said substantially cylindrical body, and the portions of said flat members surrounding said notches extending substantially parallel with each other and with said central body and on opposite sides thereof to retain said central body within said notches and to act as fins extending into the surrounding environment.
- View Dependent Claims (5, 6, 7)
Specification