Silicon junction diode rectifier power pack

• US 4,015,184 A
• Filed: 11/20/1975
• Issued: 03/29/1977
• Est. Priority Date: 11/20/1975
• Status: Expired due to Term

• Current Assignee: Clinton Supply Company
• Original Assignee: Clinton Supply Company
• Inventors: Cooperman, Seymour A.
• Primary Examiner(s): Beha, Jr., William H.
• Application Number:
  US05/633,573
• Time in Patent Office: 495 Days
• Field of Search: 321/8 C, 321/46, 317/100, 317/116, 357/81
• US Class Current: 363/141
• CPC Class Codes: H02M 7/08 arranged for operation in parallel

Abstract

A forced-air, convection-cooled, stud-mounted, silicon junction diode, full-wave rectifier power pack having improved cooling air circulation and a more effective electrical conductance and transfer of heat, along with lower and more uniform dissipation of the same, resulting in lower diode junction operating temperatures and correspondingly longer, maintenance-free service life.

Claims

1. In an air-cooled, full-wave silicon junction diode rectifier having long bolts with tubular insulation thereabout arranged in parallel side-by-side relation and a pack of elongated heat sink plates mounted in parallel side-by-side relation thereon over said tubular insulation, the improvement in conductor for transfer of D.C. current from the anode electrodes of the diodes to the main rectifier D.C. positive output busbar lying in the direction of elongation of said heat sink plates and bearing a perpendicular relation thereto comprising:

a. a cable operationally connected at one end to the anode electrodes of each of said diodes; and

b. twisted straps for support of said D.C. positive output busbar having bored flat portions at one end for slidingly mounting on said tubular insulation, each strap installed on one of said long bolts at locations corresponding to alternate pairs of heat sink plates, said straps extending from said pack in the direction of elongation of said heat sink plates having cross-sections in said direction lying in planes perpendicular to the planes of said heat sink plates, and operationally connected at said one end to the other end of said cable, and said straps fastened to and supporting and operationally connecting to said D.C. positive output busbar at the other end.

2. In an air-cooled, full-wave silicon junction diode rectifier having long bolts with tubular insulation arranged thereabout in parallel side-by-side relation and a pack of elongated heat sink plates mounted in parallel side-by-side relation thereon over said tubular insulation, the improvement in A.C. negative input busbar lying in the direction of elongation of said heat sink plates and bearing a perpendicular relation thereto comprising a twisted support strap for said A.C. negative input busbar having a bored flat portion at one end for slidingly mounting on said tubular insulation, each strap installed on the other of said long bolts at locations corresponding to the pairs of plates adjacent the ends of said bolts, said straps extending from said pack in the direction of elongation of said heat sink plates having cross-sections in said direction lying in planes perpendicular to the planes of said heat sink plates, and said straps fastened to and supporting said A.C. negative input busbar at the other end.

3. An air-cooled, full-wave silicon junction diode rectifier power pack providing for ease of diode changeability, maximum electrical conductivity and minimum heat generation comprising:

a. a frame having first and second long bolts extending in parallel side-by-side relation in the direction of the pack;

b. a plurality of flat heat sink plates each elongated in the direction of the plane of the bolts and mounted on and insulated from said bolts and packed thereon in perpendicular relation thereto, said plates spaced in said pack in parallel side-by-side relation in alternate pairs, each pair having plates spaced one from the next by a working clearance for installation of the anode electrode of said silicon junction diode therebetween, and each pair spaced on each side thereof by a working clearance between it and the next adjacent pair for installation of the threaded retention of the cathode electrode of each of said diodes in the central portion of each of said plates;

c. flat fuse means operationally connected to each heat sink plate at one end thereof and mounted in the same relative location thereon and extending therefrom in the direction of elongation of said plates having flats thereof in planes parallel to the planes of said plates;

d. first and second flat A.C. negative input busbars each bearing a perpendicular relation with said heat sink plates and lying in planes parallel to the plane of said long bolts and each operationally connected to one-half of the fuse means and mounted on and insulated from the frame by a twisted support strap having at one end a bored flat portion bearing a parallel relation with said heat sink plates for sliding over tubular insulation installed on the first of said long bolts between said pairs of plates adjacent the ends of said bolts, and at the other end a flat bolted portion extending in a plane having a perpendicular relation with said heat sink plates for attachment to one of said input bars;

e. a flat D.C. positive output busbar having a perpendicular relation with said heat sink plates and lying in a plane parallel to the plane of said long bolts, and mounted on and insulated from the frame by twisted riser straps each strap having at one end a bored flat portion bearing a parallel relation with said heat sink plates for sliding over tubular insulation installed on the second of said long bolts between said alternate pairs of plates and at the other end a bolted flat portion extending in a plane having a perpendicular relation with said heat sink plates for attachment to said output bar; and

f. a plurality of cable leads each having electrical connectors operationally connected at one end to said bored flat portion of each of said riser straps and at the other end to each of said anode electrodes of said silicon junction diodes, each diode having its cathode electrodes operationally connected to and mounted on each of said heat sink plates.

4. A silicon junction diode rectifier power pack as set forth in claim 3 wherein the heat sink plates comprise copper material having silver plating.

5. A silicon junction diode rectifier power pack as set forth in claim 3 wherein the fuse means comprises copper material having silver plating and elongated in the direction of the elongation of said heat sink plates.

6. A silicon junction diode rectifier power pack as set forth in claim 3 wherein the A.C. negative input busbar comprises an elongated plate of copper material having silver plating.

7. A silicon junction diode rectifier power pack as set forth in claim 3 wherein the D.C. positive output busbar comprises an elongated plate of copper material having silver plating.

8. A forced-air, convection-cooled, full-wave silicon junction diode rectifier power pack comprising:

a. a supporting structure;

b. a first plurality of heat sink fins of rectangular shape and uniform edgewise thickness mounted on and insulated from said supporting structure in mutually spaced and parallel relation thereon;

c. a first plurality of flat fuse elements each fuse element having one terminal operationally connected to and mounting edgewise on one end of each of the first plurality of heat sink fins;

d. a first A.C. input feeder bar support strap having one end mounted edgewise on and insulated from said supporting structure in edgewise relation to the heat sink fins;

e. a first A.C. input feeder bar operationally connected to the other terminal of each of the first plurality of fuse elements and mounting on the other end of said first support strap in edgewise relation to the heat sink fins;

f. a first plurality of stud-mounted, silicon junction diodes, each diode operationally connected to and centrally mounting on each heat sink fin;

g. a second plurality of heat sink fins of rectangular shape and uniform edgewise thickness mounted on and insulated from said supporting structure in mutually spaced and parallel relation thereon;

h. a second plurality of fuse elements, each fuse element having one terminal operationally connected to and mounting edgewise on one end of each heat sink fin;

i. a second A.C. input feeder bar support strap mounted edgewise on and insulated from said supporting structure in edgewise relation to the heat sink fins;

j. a second A.C. input feeder bar operationally connected to the other terminal of each of the second plurality of fuse elements amd mounting on the other end of said first support strap in edgewise relation to the heat sink fins;

k. a second plurality of stud-mounted, silicon-junction diodes, each diode operationally connected to and centrally mounting on each heat sink fin;

l. a second A.C. input feeder bar operationally connected to the other terminal of each of the second plurality of fuses and mounting on the other end of said second support strap in edgewise relation to the heat sink fins;

m. a plurality of combination D.C. output riser bars operationally connected at one end to the lugit on the end of each cable lead on each stud-mounted, silicon junction diode and D.C. output bus bar support strap mounted edgewise on and insulated from said supporting structure in edgewise relation to the heat sink fins; and

n. a D.C. output bus bar operationally connected to the other terminal of each of the second plurality of combination D.C. output riser bars and D.C. output bus bar support straps.