Grinding method
First Claim
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1. A method for segmenting a plate-like material into a plurality of individual pellets comprising the steps of:
- a. forming grooves in the surface of said plate-like material by scribing said surface with a rotating grinder blade while causing washing fluid to flow over the entire surface of said plate-like material; and
b. simultaneously with step (a), spraying a cooling fluid at the contact portion of said blade and the groove surface portion of said plate-like material.
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Abstract
A method for segmenting a plate-like material, particularly a semiconductor wafer on which a plurality of elements are formed in regular arrangement, is provided. Segmentation is performed while flowing a fluid over the entire surface of the plate-like material to wash the surface thereof.
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Citations
10 Claims
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1. A method for segmenting a plate-like material into a plurality of individual pellets comprising the steps of:
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a. forming grooves in the surface of said plate-like material by scribing said surface with a rotating grinder blade while causing washing fluid to flow over the entire surface of said plate-like material; and b. simultaneously with step (a), spraying a cooling fluid at the contact portion of said blade and the groove surface portion of said plate-like material. - View Dependent Claims (2, 3, 4, 5, 6, 8, 9)
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7. In an apparatus for segmenting a plate-like material into a plurality of individual pellets having a rotating grinder blade forming grooves in the surface of said plate-like material and first means for supplying a cooling fluid thereto, the improvement comprising:
second means, disposed adjacent to said plate-like material, for causing washing fluid to flow over the entire surface of said plate-like material simultaneously with the supplying of cooling fluid by said first means, to thereby completely wash away cuttings from the surface of said plate-like material. - View Dependent Claims (10)
Specification