×

Thin film circuit

  • US 4,020,222 A
  • Filed: 06/18/1975
  • Issued: 04/26/1977
  • Est. Priority Date: 06/19/1974
  • Status: Expired due to Term
First Claim
Patent Images

1. A thin film circuit comprising a planar substrate of insulating material, supported by said substrate at least one metal film, from which are made by photolithographic techniques the capacitors as well as the resistors, said metal film consisting of an alloy of aluminum with between 2 and 20 atom per cent tantalum and containing oxygen in an amount sufficient so that the temperature coefficient of the resistors is between -300 and -500 ppm/K in order to compensate the positive TCC of the capacitors with the negative TCR of the resistors in RC-networks.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×