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Hall element and method of manufacturing same

  • US 4,021,767 A
  • Filed: 07/11/1975
  • Issued: 05/03/1977
  • Est. Priority Date: 06/12/1975
  • Status: Expired due to Term
First Claim
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1. A Hall element comprising:

  • an evaporated thin film of a semiconductor having a high mobility and having a thickness of 0.5 to 1.5μ

    , separated from an evaporation substrate after evaporation;

    input electrodes and output electrodes formed on one surface of the evaporated thin film;

    a first magnetizable member bonded to said one surface of the evaporated thin film by a layer of adhesive disposed between said first member and said one surface; and

    a second magnetizable member bonded to the other surface of the evaporated thin film by a layer of adhesive disposed between said second member and said other surface.

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