Method for attaching a fused-quartz mirror to a conductive metal substrate
First Claim
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1. A method for attaching a fused-quartz mirror to a conductive metal substrate comprising the steps of:
- A. tinning one substantially planar surface of a fused-quartz mirror with a solder of a class including pure indium solder;
B. tinning a metal substrate with an indium eutectic alloy consisting essentially of indium, bismuth, lead and tin, having a melting point substantially below that of the solder;
C. heating the alloy to a temperature substantially above its melting point, but below that of the solder;
D. establishing a contiguous relationship between the tinned surface of the mirror and a surface of the alloy while maintaining the temperature of the alloy substantially above the melting point of the alloy; and
E. cooling the alloy to a temperature substantially below its melting point while maintaining the established contiguous relationship between the surfaces of the mirror and the alloy.
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Abstract
A method for attaching a fused-quartz mirror to a conductive metal substrate which comprises the steps of tinning one surface of a fused-quartz mirror with a solder of substantially pure indium, tinning a metallic substrate with an indium eutectic alloy consisting essentially of indium, bismuth, lead and tin having a melting point substantially below that of indium, heating the eutectic alloy to a temperature substantially above its melting point, but below that of the solder, floating the mirror into place, and subsequently cooling the alloy to a temperature substantially below its melting point.
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Citations
4 Claims
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1. A method for attaching a fused-quartz mirror to a conductive metal substrate comprising the steps of:
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A. tinning one substantially planar surface of a fused-quartz mirror with a solder of a class including pure indium solder; B. tinning a metal substrate with an indium eutectic alloy consisting essentially of indium, bismuth, lead and tin, having a melting point substantially below that of the solder; C. heating the alloy to a temperature substantially above its melting point, but below that of the solder; D. establishing a contiguous relationship between the tinned surface of the mirror and a surface of the alloy while maintaining the temperature of the alloy substantially above the melting point of the alloy; and E. cooling the alloy to a temperature substantially below its melting point while maintaining the established contiguous relationship between the surfaces of the mirror and the alloy. - View Dependent Claims (2, 3, 4)
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Specification