Method for attaching a fused-quartz mirror to a conductive metal substrate

• US 4,033,503 A
• Filed: 08/27/1976
• Issued: 07/05/1977
• Est. Priority Date: 08/27/1976
• Status: Expired due to Term

• Current Assignee: Daniel Mckeown, Fletcher James C Administrator of The National Aeronautics and Space Administration With Respect To An Invention of, George Sonnenschein
• Original Assignee: Daniel Mckeown, Fletcher James C Administrator of The National Aeronautics and Space Administration With Respect To An Invention of, George Sonnenschein
• Inventors: McKeown, Daniel, Sonnenschein, George, Fletcher, James C. Administrator of the National Aeronautics and Space Administration, with respect to an invention of
• Primary Examiner(s): Smith, Al Lawrence
• Assistant Examiner(s): Ramsey, K. J.
• Application Number:
  US05/718,267
• Time in Patent Office: 312 Days
• Field of Search: 228/121, 228/122, 228/123, 228/124, 228/263
• US Class Current: 228/124.1
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 35/264 Bi as the principal constituent

Abstract

A method for attaching a fused-quartz mirror to a conductive metal substrate which comprises the steps of tinning one surface of a fused-quartz mirror with a solder of substantially pure indium, tinning a metallic substrate with an indium eutectic alloy consisting essentially of indium, bismuth, lead and tin having a melting point substantially below that of indium, heating the eutectic alloy to a temperature substantially above its melting point, but below that of the solder, floating the mirror into place, and subsequently cooling the alloy to a temperature substantially below its melting point.

Claims

1. A method for attaching a fused-quartz mirror to a conductive metal substrate comprising the steps of:

A. tinning one substantially planar surface of a fused-quartz mirror with a solder of a class including pure indium solder;

B. tinning a metal substrate with an indium eutectic alloy consisting essentially of indium, bismuth, lead and tin, having a melting point substantially below that of the solder;

C. heating the alloy to a temperature substantially above its melting point, but below that of the solder;

D. establishing a contiguous relationship between the tinned surface of the mirror and a surface of the alloy while maintaining the temperature of the alloy substantially above the melting point of the alloy; and

E. cooling the alloy to a temperature substantially below its melting point while maintaining the established contiguous relationship between the surfaces of the mirror and the alloy.

2. The method of claim 1 wherein said eutectic alloy consists essentially of twenty parts by weight indium, fifty parts by weight bismuth, eighteen parts by weight lead, and twelve parts by weight tin.

3. The method of claim 1 further comprising the step of vibrating the mirror prior to cooling the alloy while the contiguous relation between the alloy and the tinned surface is maintained.

4. The method of claim 1 wherein said metallic substrate includes an endless peripheral lip.