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Method of fabricating an array of semiconductor devices

  • US 4,040,169 A
  • Filed: 12/29/1975
  • Issued: 08/09/1977
  • Est. Priority Date: 03/04/1974
  • Status: Expired due to Term
First Claim
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1. In a method of fabricating an array of semiconductor devices on a substrate utilizing an alignment tool having a body with a plurality of spaced apart recesses with outwardly diverging side walls extending to one surface thereof, the steps of:

  • forming a plurality of individual semiconductor devices having bonding pads on one side thereof and inclined side walls diverging toward the bonding pads, placing the individual semiconductor devices in the recesses in the alignment tool with the inclined walls of the semiconductor devices engaging the outwardly diverging walls of the recesses and the bonding pads protruding beyond the surface of the tool, forming a metallized layer on one surface of the substrate, positioning the surfaces of the alignment tool and the substrate in confronting relationship with the bonding pads aligned with predetermined portions of the metallized layer, heating the metallized layer to a predetermined temperature, and pressing the alignment tool and substrate together to bring the bonding pads into contact with the metallized layer and thereby effect bonding of the semiconductor devices to the substrate.

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