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Electroplating method

  • US 4,043,878 A
  • Filed: 06/14/1976
  • Issued: 08/23/1977
  • Est. Priority Date: 06/14/1976
  • Status: Expired due to Term
First Claim
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1. In the method of electrolytically depositing on the surface of a substrate metal a layer of a metal having a plurality of discrete particles of a finely divided solid non-metallic material uniformly dispersed throughout said layer, said metal layer and said particles being co-deposited from an aqueous electrolyte solution containing said metal in solution and said particles in suspension therein, said electrolyte solution containing a surface active agent deposition promoter for the non-metallic material and being agitated to maintain the particles uniformly in suspension therein, the improvement which comprises employing as said deposition promoter a surface active agent selected from the group having the chemical structure:

  • ##STR4## Where R1 is an alkyl, alkene or alkyne radical having from 6 to 22 carbon atoms,R2 is an alkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms, andR3 is an alkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms.

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