Stress-free hall-cell package

• US 4,048,670 A
• Filed: 06/30/1975
• Issued: 09/13/1977
• Est. Priority Date: 06/30/1975
• Status: Expired due to Term

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Sprague Electric Company
• Inventors: Eysermans, Hubert
• Primary Examiner(s): Smith, Jr., David
• Application Number:
  US05/591,684
• Time in Patent Office: 806 Days
• Field of Search: 317/101 C, 317/101 R, 174/52 PE, 357/72, 357/26, 29/588, 361/421
• US Class Current: 361/813
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H10N 52/80 Constructional details

Abstract

A thin stress-free hall-cell package includes a semiconductor hall-cell chip that is completely enveloped by a resilient cushioning material which is in turn held within a cup. The cup is attached to or is a part of at least one of the metal leads. Wires connect the leads to terminal-pads on the chip through the resilient cushioning material. The method for making the package includes providing support for the cup by one or more of the leads, placing the chip in the cup, dispensing a silicone resin into the cup and heat curing the resin. The package is completed with encapsulation of the cup and adjacent lead ends by a hard resin. The cup advantageously has a hole in its bottom such that a chip placed thereover is held in position for wire bonding by evacuating the hole from underneath by means of a vacuum system. A hot pin is then inserted in the hole to elevate the chip, the pin is retracted to be about flush with the inside of the cup bottom and liquid resin dispersed therein and completely envelops the chip. The resin cures locally about the hot pin. The pin is removed and the resin is completely cured in an oven.

Claims

1. A stress-free hall-cell package comprising:

a. a semiconductor chip having a hall-cell formed therein and lying in one plane, said chip having conductive terminal pads on a surface thereof for providing electrical access to said hall-cell;

b. at least three metal leads, an end portion of each of said leads lying in and defining another plane that is essentially parallel with said one plane;

c. a cup abutting at least one of said metal leads;

d. at least three metal wires each having one end connected to one of said terminal pads and another end connected to one of said leads near said end portion thereof;

e. an insulative elastomeric protective covering being contained in said cup, and completely except at said one end of said wires; and

f. an electrically insulating housing means for encapsulating and providing mechanical support to said cup and to said end portions of said leads.

2. The package of claim 1 wherein said semiconductor chip additionally includes an integrated circuit amplifier and an electrical coupling means for coupling the output of said hall-cell to the input of said amplifier, whereby a portion of said electrical access to said hall-cell is had through said amplifier.

3. The package of claim 1 wherein said at least three leads are essentially rectangular in cross-section and lie in the namely said another plane, having been cut from a standard lead frame.

4. The package of claim 1 wherein said cup has a hole in a bottom portion thereof.

5. The package of claim 1 wherein said cup abuts two of said leads, said cups having been capable of being entirely supported thereby during the assembly of said package.

6. The package of claim 1 wherein said cup is a metal extension of said at least one abutting lead.

7. The package of claim 1 wherein said cup is formed by a ring having been mounted on a metal extension of one of said leads, said lead extension serving as the bottom of said cup.