Method for making a circuit board and article made thereby

• US 4,049,844 A
• Filed: 03/24/1976
• Issued: 09/20/1977
• Est. Priority Date: 09/27/1974
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Lucas, Gary M., Bolon, Donald A., Bartholomew, Ralph L.
• Primary Examiner(s): Esposito, Michael F.
• Application Number:
  US05/670,044
• Time in Patent Office: 545 Days
• Field of Search: 96/36.2, 427/44, 427/96, 427/54, 427/126, 427/123, 427/125, 427/282, 427/217, 204/159.15, 204/159.18, 252/501, 252/510, 252/514, 317/101 B, 317/101 C, 317/101 CC, 317/101 F, 200/61.02, 174/68.5, 431/93, 431/94, 431/95 R, 431/95 A, 428/901, 337/413, 337/414, 354/35, 354/143
• US Class Current: 427/511
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: Y10S 428/901 Printed circuit

Abstract

A method is provided for making a circuit board involving the screen printing of a radiation curable ink onto the surface of a substrate followed by the radiation cure of the ink. A photoflash circuit board array made by such method is also provided.

Claims

1. A method for making a circuit board having conductive circuit elements with a specific resistivity of less than 10 ohm-cm patterned on a nonconductive substrate, which comprises,printing a radiation curable ink onto the nonconductive substrate to a desired circuit pattern, andeffecting the radiation cure of the radiation curable ink, where said radiation curable ink comprises by volume

A. from about 10% to 60% of an organic resin binder having a viscosity of from 50 to 10,000 centipoises at 25°

C., and

B. from about 90% to 40% of a particulated electrically conductive metal containing material substantially free of metal containing material having an aspect ratio of diameter to thickness of a value greater than 20.

2. A method in accordance with claim 1, where the radiation curable ink is screen printed onto the nonconductive substrate.

3. A method in accordance with claim 1, where the radiation cure is achieved with ultraviolet light.

4. A method of claim 1, where the curable ink utilizes silver coated glass spheres or spheroids as the particulated electrically conductive metal containing material.

5. The method of claim 1, where the nonconductive substrate is polystyrene.

6. The method of claim 4, where a mixture of a polyester resin and styrene are used as the organic resin binder.

7. The method of claim 1, having a subsequent step for the application of a switch composition onto the nonconductive substrate to produce a circuit board suitable for a photolamp array consisting of flash lamp connection areas and switching circuitry allowing for the consecutive flashing of photolamps electrically connected thereto.

8. The method of claim 7, where the switch composition comprises a mixture of silver oxide and silver carbonate.

9. The method of claim 8, where the switch composition contains an effective amount of benzotriazole.