Method of gettering using backside polycrystalline silicon
First Claim
1. The method for gettering impurities and for removal of point defects from silicon semiconductor material comprising:
- providing a body of monocrystalline silicon material suitable for forming semiconductor devices therein;
depositing a layer of polycrystalline silicon on one major surface of said body by hydrogen reduction of a silicon-containing gas which is passed over said body along with a inert carrier gas while said body is maintained at a temperature between about 600°
C. to 800°
C.;
said layer being predominently oriented to one crystallographic orientation; and
forming semiconductor devices on the major surface opposite to the said one major surface of said body which involve processing temperatures between about 800°
C. to 1100°
C.
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Abstract
An integrated circuit structure and method for manufacturing same which provides for gettering with a backside layer of polycrystalline silicon. The gettering of unwanted impurities from the integrated circuits involves the deposition of a polycrystalline silicon film on a semiconductor wafer prior to any or some high temperature processing steps. The semiconductor body is then subjected to the normal semiconductor processing steps to form semiconductor devices on the surface opposite to the surface having the polycrystalline silicon layer. During these high temperature processing steps, unwanted impurities such as copper, iron, nickel, sodium and potassium ions move toward and into the polycrystalline silicon layer and thereby away from the semiconductor devices. This produces improved yield in the integrated circuit process.
127 Citations
11 Claims
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1. The method for gettering impurities and for removal of point defects from silicon semiconductor material comprising:
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providing a body of monocrystalline silicon material suitable for forming semiconductor devices therein; depositing a layer of polycrystalline silicon on one major surface of said body by hydrogen reduction of a silicon-containing gas which is passed over said body along with a inert carrier gas while said body is maintained at a temperature between about 600°
C. to 800°
C.;said layer being predominently oriented to one crystallographic orientation; and forming semiconductor devices on the major surface opposite to the said one major surface of said body which involve processing temperatures between about 800°
C. to 1100°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification