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Temperature controlled airborne electronic assembly

  • US 4,057,104 A
  • Filed: 08/26/1976
  • Issued: 11/08/1977
  • Est. Priority Date: 08/26/1976
  • Status: Expired due to Term
First Claim
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1. An airborne assembly comprising,a pod for mounting on the exterior of an aircraft in subjection to air flow past the aircraft during flight,heat creating electronic components disposed within said pod, p1 evaporative cooling fluid disposed within said pod, p1 vertically extending evaporator means within said pod in close thermal coupling with said electronic components and having bottom inlet for said cooling fluid in liquid state and an upper exit for said cooling fluid in vapor state,a first condenser means for the cooling fluid vapor from said evaporator means utilizing the outer skin of said pod for transfer of heat to the air passing thereover,duct means for return of cooling fluid in liquid state from said first condenser means to said evaporator inlet,a second condenser means in form of heat sink means within said pod, and

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