Temperature controlled airborne electronic assembly
First Claim
1. An airborne assembly comprising,a pod for mounting on the exterior of an aircraft in subjection to air flow past the aircraft during flight,heat creating electronic components disposed within said pod, p1 evaporative cooling fluid disposed within said pod, p1 vertically extending evaporator means within said pod in close thermal coupling with said electronic components and having bottom inlet for said cooling fluid in liquid state and an upper exit for said cooling fluid in vapor state,a first condenser means for the cooling fluid vapor from said evaporator means utilizing the outer skin of said pod for transfer of heat to the air passing thereover,duct means for return of cooling fluid in liquid state from said first condenser means to said evaporator inlet,a second condenser means in form of heat sink means within said pod, and
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Abstract
A streamlined electronic-component-containing pod is mounted on the exterior of a military aircraft in subjection to the airflow past the aircraft during flight. An evaporator in the pod is close coupled thermally to the electronic components for cooling. The outer skin of the pod acts as a condenser for return of liquid refrigerant to the evaporator during normal flight operations. During short-term high-speed dash operation the outer skin of the pod becomes too hot for condensing refrigerant vapor, which then becomes condensed by a heat sink. At this time the refrigerant at the outer skin remaining in the vapor phase acts as thermal insulation.
44 Citations
7 Claims
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1. An airborne assembly comprising,
a pod for mounting on the exterior of an aircraft in subjection to air flow past the aircraft during flight, heat creating electronic components disposed within said pod, p1 evaporative cooling fluid disposed within said pod, p1 vertically extending evaporator means within said pod in close thermal coupling with said electronic components and having bottom inlet for said cooling fluid in liquid state and an upper exit for said cooling fluid in vapor state, a first condenser means for the cooling fluid vapor from said evaporator means utilizing the outer skin of said pod for transfer of heat to the air passing thereover, duct means for return of cooling fluid in liquid state from said first condenser means to said evaporator inlet, a second condenser means in form of heat sink means within said pod, and
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2. p1 duct means for conveying cooling fluid to and from said second condenser means in series with said evaporator means and in parallel with said first condenser means,
said second condenser means being so constructed and arranged as to be effective at pod skin temperatures at which said first condenser means becomes ineffective.
Specification