Photocurable compositions containing group via aromatic onium salts
First Claim
1. Photocurable compositions consisting essentially ofA. an epoxy resin polymerizable to a higher molecular weight state,B. from 0.1 to 15% by weight of a photodecomposable aromatic onium salt of a Group VIa element capable of effecting the cure of epoxy resin when exposed to radiant energy wherein said aromatic onium salt has the formula
where R is a monovalent aromatic organic radical, R1 is a monovalent organic aliphatic radical selected from alkyl, cycloalkyl and substituted alkyl, R2 is a polyvalent organic radical forming a heterocyclic or fused ring structure selected from aliphatic radicals and aromatic radicals, X is a Group VIa element selected from sulfur, selenium and tellurium, M is a metal or metalloid, Q is a halogen radical, a is a whole number equal to 0 to 3 inclusive, b is a whole number equal to 0 to 2 inclusive, c is a whole number equal to 0 or 1, where the sum of a + b + c is a value equal to 3 or the valence of X,d = e - ff = valence of M and is an integer equal to from 2 to 7 inclusivee is >
f and is an integer having a value up to 8 andC. from 0 to 100 parts by weight of filler, per 100 parts of epoxy resin.
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Abstract
Cationic polymerization of epoxy resin materials, such as epoxy monomers or prepolymers, can be achieved by use of certain radiation sensitive aromatic onium salts of Group VIa elements. Curable compositions are provided which can be used as sealants, coating compounds, encapsulants, etc.
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Citations
15 Claims
- 1. Photocurable compositions consisting essentially of
A. an epoxy resin polymerizable to a higher molecular weight state, B. from 0.1 to 15% by weight of a photodecomposable aromatic onium salt of a Group VIa element capable of effecting the cure of epoxy resin when exposed to radiant energy wherein said aromatic onium salt has the formula - space="preserve" listing-type="equation">[(R).sub.a (R.sup.1).sub.b (R.sup.2).sub.c X].sub.d .sup.+ [MQ.sub.e ].sup.-(e-f)
where R is a monovalent aromatic organic radical, R1 is a monovalent organic aliphatic radical selected from alkyl, cycloalkyl and substituted alkyl, R2 is a polyvalent organic radical forming a heterocyclic or fused ring structure selected from aliphatic radicals and aromatic radicals, X is a Group VIa element selected from sulfur, selenium and tellurium, M is a metal or metalloid, Q is a halogen radical, a is a whole number equal to 0 to 3 inclusive, b is a whole number equal to 0 to 2 inclusive, c is a whole number equal to 0 or 1, where the sum of a + b + c is a value equal to 3 or the valence of X, d = e - f f = valence of M and is an integer equal to from 2 to 7 inclusive e is >
f and is an integer having a value up to 8 andC. from 0 to 100 parts by weight of filler, per 100 parts of epoxy resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
Specification
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- Resources
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Current AssigneeGeneral Electric Company
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Original AssigneeGeneral Electric Company
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InventorsCrivello, James V.
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Primary Examiner(s)Brammer, Jack P.
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Application NumberUS05/638,982Time in Patent Office707 DaysField of Search96/115 R, 96/115 P, 96/35.1, 96/86 P, 204/159.18, 204/159.23, 204/159.24, 260/2 EP, 260/2 EC, 260/47 EC, 260/47 EN, 106/20US Class Current430/280.1CPC Class CodesC08G 59/68 characterised by the cataly...G03F 7/029 Inorganic compounds; Onium ...Y10S 430/114 Initiator containing
