Multilayer flexible printed circuit tape

• US 4,064,552 A
• Filed: 02/03/1976
• Issued: 12/20/1977
• Est. Priority Date: 02/03/1976
• Status: Expired due to Term

• Current Assignee: Joseph L. Angelucci, Thomas L. Angelucci
• Original Assignee: Joseph L. Angelucci, Thomas L. Angelucci
• Inventors: Angelucci, Joseph L., Angelucci, Thomas L.
• Primary Examiner(s): Smith, Jr., David
• Application Number:
  US05/654,749
• Time in Patent Office: 686 Days
• Field of Search: 317/101 CP, 317/101 CM, 317/101 F, 174/52 FP, 174/52 S, 174/68.5, 29/626, 29/624, 29/625, 339/17 F, 361/401, 361/398, 361/414, 361/400
• US Class Current: 361/795
• CPC Class Codes: G04G 17/02 Component assemblies
• CPC Class Codes: G04G 17/04 Mounting of electronic components
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/7665 Means for transporting the components to be connected
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/0781 being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0397 : Tab
• CPC Class Codes: H05K 2201/10477 : Inverted
• CPC Class Codes: H05K 3/363 : by soldering
• CPC Class Codes: H05K 3/4084 : by deforming at least one of the conductive layers

Abstract

A multilayer flexible printed circuit tape that functions as a flexible printed circuit carrier for receiving one or more active circuit components and/or other inactive components to provide an electronic module. The multilayer flexible printed circuit tape comprises a plurality of etched foil patterns on dielectric carriers arranged in a plurality of planes or layers. Each foil pattern is connected to individual electrical terminals of said components and is further provided with inter-layer connection means, which are connected through apertures in the multilayer dielectric carrier. The lead-out electrical terminals from the module are provided in a mutual plane to permit ease in making connections of the electrical current terminals to a common plane of a circuit system.

Claims

1. A multilayer flexible printed circuit tape having conductive attachment leads terminating in a mutual plane comprising:

a first flexible printed circuit top tape,

said top tape comprising a first dielectric carrier having at least one device aperture for receiving a semiconductor device,

a plurality of connection apertures and a plurality of indexing apertures therein,

a first flexible conductive foil pattern bonded to the top of said top tape comprising a plurality of inner flexible conductive fingers extending over said device aperture and a plurality of outer flexible conductive leads extending over said connection apertures,

a semiconductor device positioned in said device aperture and having a plurality of conductive lead-out pads thereon connected to said inner conductive fingers of said first conductive foil pattern,

a second flexible printed circuit bottom tape,

said bottom tape comprising a second dielectric carrier comprising a plurality of connection apertures and a plurality of indexing apertures therein, said apertures having the same location pattern as said aperture in said top tape,

an adhesive layer bonding the top of said second dielectric carrier to the bottom of said first dielectric carrier to form a laminate therewith,

a second flexible conductive foil pattern bonded to the bottom of said bottom tape comprising a plurality of intermediate flexible conductive paths thereon, and

a plurality of said outer flexible leads on said top tape extending through said connection apertures of said tapes and being bonded to said individual conductive leads on said bottom tape to provide a multilayer printed circuit tape.

2. A multilayer flexible printed circuit tape as set forth in claim 1 wherein said first flexible conductive foil pattern further includes,

a plurality of intermediate flexible conductive paths, and

a plurality of discrete components connected to some of said intermediate flexible conductive paths to form an electronic circuit module therewith.

3. A multilayer flexible printed circuit tape as set forth in claim 1 wherein one of said flexible conductive foil patterns further includes,

a plurality of intermediate flexible conductive paths, and

a plurality of discrete components connected to some of said intermediate flexible conductive paths to form an electronic circuit module therewith.

4. A multilayer flexible printed circuit tape as set forth in claim 3 wherein one of said discrete components comprises a display mounted on a flexible tape which is mounted on said multilayer flexible printed circuit tape.

5. A multilayer flexible printed circuit tape as set forth in claim 3 which further includes

a case for holding said module, and

a frame for retaining said module in said case,

6. A multilayer flexible printed circuit as set forth in claim 5 which further includes a first polarity battery terminal connection connected to at least one of said plurality of said flexible conductive leads of said bottom tape.

7. A multilayer flexible printed circuit tape as set forth in claim 6 wherein at least one other of said plurality of said intermediate flexible conductive paths comprises a second polarity battery terminal connection.

8. A multilayer flexible printed circuit tape as set forth in claim 3 which further includes a trimmer capacitor comprising one of said conductive foil patterns bonded to one of said dielectric tapes.

9. The method of making multilayer flexible printed circuit tape comprising the steps of:

forming a first and second imperforate flexible dielectric strips of tape,

applying an adhesive layer to one side of said first and said second dielectric strips of tape,

perforating said dielectric strips of tape with a plurality of indexing apertures, a plurality of connection apertures and at least one device aperture, therein,

bonding conductive foil strips to said adhesive layer on said first and said second dielectric strips of tape,

forming a conductive pattern in said conductive foil strip on said first dielectric strip of tape to provide a plurality of conductive cantilever leads extending into and over said device aperture and said connection apertures,

bonding said conductive cantilever leads at said central aperture to the electrical connection points on a semiconductor device,

forming a conductive pattern in said conductive foil strip on said second dielectric strip of tape to provide a plurality of conductive leads having bonding pads in pattern registration with said conductive cantilever leads at said connection apertures,

adhesive bonding said first and said second dielectric tapes together at the sides opposite the foil coated sides with said indexing apertures, said connection apertures and said device apertures in pattern registration, and

bonding said conductive cantilever at said connection apertures to said conductive leads at said bonding pads at said connection apertures to provide a multilayer flexible printed circuit tape.

10. A multilayer flexible printed circuit tape having conductive attachment leads for interconnecting a plurality of active components comprising:

a first flexible printed circuit top tape,

said top tape comprising a first dielectric carrier having a plurality of device apertures therein for receiving active semiconductor devices and a plurality of indexing apertures,

a first flexible conductive foil pattern bonded to the top of said top tape comprising a plurality of inner flexible conductive fingers each extending over one of said device apertures and a plurality of outer flexible conductive leads,

semiconductor devices positioned in said apertures and having at least one lead-out pads thereon connected to said inner conductive fingers of said first conductive foil pattern

a second flexible printed circuit bottom tape,

said bottom tape comprising a second dielectric carrier having a plurality of device apertures therein for receiving active semiconductor devices and a plurality of indexing apertures, said apertures in said bottom tape having the same location pattern as said apertures in said top tape,

an adhesive layer bonding the top of said bottom tape to the bottom of said top tape to form a multilayer laminate therewith,

a second flexible conductive foil pattern bonded to the bottom of said bottom tape comprising a plurality of intermediate flexible conductive paths thereon, and at least one terminal lead-out pad on the bottom of said semiconductor devices,

said plurality of intermediate flexible conductive paths on said second flexible conductive foil pattern being bonded to said terminal lead-out pad to form an assembled circuit between said terminal lead out pad and said outer flexible conductive leads.

11. A multilayer flexible printed circuit tape as set forth in claim 10 wherein said plurality of intermediate flexible conductive paths comprise continuous foil terminal pads covering the bottom of said semiconductor devices.

12. A multilayer flexible printed circuit tape as set forth in claim 10 which further comprises:

a plurality of connection apertures in said top tape and said bottom tape,

a plurality of outer flexible leads on said first flexible conductive foil pattern,

said outer flexible leads extending through said connection apertures of said tapes and being bonded to individual ones of said intermediate flexible conductive paths on said second flexible conductive foil pattern.