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Susceptor based bonding technique for plastic material utilizing oleaginous substance at the bonding interface

  • US 4,067,765 A
  • Filed: 09/17/1976
  • Issued: 01/10/1978
  • Est. Priority Date: 09/17/1976
  • Status: Expired due to Term
First Claim
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1. A method for the thermal bonding of first and second plastic elements over a joinder interface portion comprising:

  • interposing between the joinder interface portions a film of an oleaginous substance;

    juxtapositioning the elements so that the interface portions thereof to be joined are contiguous to form with the interposed film a joinder region including the film and the plastic material of such elements;

    incorporating within the joinder region heat generating particles generating heat in the particles upon exposure to a high frequency energy field;

    exposing the heat source particles to the high frequency energy field to heat the plastic material in the contiguous joinder interface portions to thermal bonding temperature; and

    retaining the joinder interface portions in intimate contact until a thermal bond is formed.

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