Susceptor based bonding technique for plastic material utilizing oleaginous substance at the bonding interface
First Claim
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1. A method for the thermal bonding of first and second plastic elements over a joinder interface portion comprising:
- interposing between the joinder interface portions a film of an oleaginous substance;
juxtapositioning the elements so that the interface portions thereof to be joined are contiguous to form with the interposed film a joinder region including the film and the plastic material of such elements;
incorporating within the joinder region heat generating particles generating heat in the particles upon exposure to a high frequency energy field;
exposing the heat source particles to the high frequency energy field to heat the plastic material in the contiguous joinder interface portions to thermal bonding temperature; and
retaining the joinder interface portions in intimate contact until a thermal bond is formed.
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Abstract
A film of an oleaginous substance is interposed between the surfaces of plastic elements to be joined by a thermal bond. The heat necessary for bonding is obtained by the incorporation of heat generating particles in the bond region, either in the plastic element or in the film. The particles are indirectly heatable by a high frequency alternating magnetic field or other suitable field. This provides a rapid and efficient heating of the surfaces to the bonding temperature, with the oleaginous substance enhancing the bonding action and the properties of the bond.
38 Citations
21 Claims
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1. A method for the thermal bonding of first and second plastic elements over a joinder interface portion comprising:
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interposing between the joinder interface portions a film of an oleaginous substance; juxtapositioning the elements so that the interface portions thereof to be joined are contiguous to form with the interposed film a joinder region including the film and the plastic material of such elements; incorporating within the joinder region heat generating particles generating heat in the particles upon exposure to a high frequency energy field; exposing the heat source particles to the high frequency energy field to heat the plastic material in the contiguous joinder interface portions to thermal bonding temperature; and retaining the joinder interface portions in intimate contact until a thermal bond is formed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for the thermal bonding of first and second thermoplastic elements over an interface joinder portion comprising:
- forming a mixture of an oleaginous substance and solid plastic particles bondably compatible with said elements, interposing a film of said mixture at the interface joinder portion, incorporating in the interface joinder portion dispersed susceptor particles heatable upon exposure to a high frequency energy field; and
exposing the susceptor particles to the energy field to heat the interface joinder portion including said film and plastic particles to bonding temperature to form an integral thermal bond between the elements and the plastic particles. - View Dependent Claims (19, 20, 21)
- forming a mixture of an oleaginous substance and solid plastic particles bondably compatible with said elements, interposing a film of said mixture at the interface joinder portion, incorporating in the interface joinder portion dispersed susceptor particles heatable upon exposure to a high frequency energy field; and
Specification