Diffusion bonding of crystals

• US 4,077,558 A
• Filed: 12/06/1976
• Issued: 03/07/1978
• Est. Priority Date: 12/06/1976
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Steving, Gerald, Carlson, Jeffrey Allen, Schwartz, Bradford Clyde
• Primary Examiner(s): Kelly, Donald G.
• Application Number:
  US05/748,249
• Time in Patent Office: 456 Days
• Field of Search: 228/121, 228/193-195, 29/25.35
• US Class Current: 228/121
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 1/20 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C
• CPC Class Codes: B23K 20/22 taking account of the properties of the materials to be welded
• CPC Class Codes: B23K 35/001 Interlayers, transition pieces for metallurgical bonding of workpieces
• CPC Class Codes: G02F 1/11 based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves acousto-optical deflection G02F1/33
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives

Abstract

A method of bonding two crystals together is disclosed. A bond enhancing material such as chromium (Cr) is vapor deposited on one crystal, and on this is vapor deposited a noble metal such as gold (Au). On the other crystal a low melting point metal such as tin (Sn) or indium (In) is vapor deposited. In the case of In this can either be directly on the crystal or on a layer of bond enhancing material; in the case of Sn this must be on a bond enhancing material. On top of the low melting point metal a layer of the same noble metal is deposited to prevent oxidation thereof. The noble metal layers are brought into contact with each other in vacuum or inert atmosphere and pressure applied thereto at a temperature of 100° C to 150° C in the case of In and 100° C to 200° C in the case of Sn. The low melting point metal will diffuse into the noble metals and across the interface causing a bond to form by elimination of the boundary between the crystals.

Claims

1. A method of bonding two crystals together comprising the steps of:

depositing a layer of bond enhancing material on one of said crystals;

depositing a layer of a noble metal on said bond enhancing material;

depositing on said other crystal a low melting point metal selected from the group Sn and In;

depositing a layer of noble metal on said low melting point metal to prevent oxidation thereof; and

bringing together the noble metal layers at a temperature of between 100°

C and 200°

C and applying a pressure in excess of 50 pounds per-square-inch to cause a diffusion bond between the noble metal atoms and the low melting point metal atoms.

2. The invention as defined in claim 1 wherein said metals are vapor deposited.

3. The invention as defined in claim 1 wherein said bond enhancing material is selected from the group Cr, Ti, and Al.

4. The invention as defined in claim 1 wherein a layer of bond enhancing material is deposited on said other crystal beneath said low melting point metal.

5. The invention as defined in claim 1 wherein said low melting point metal is In and is deposited directly on said other crystal without an intermediate layer of bond enhancing metal.

6. The invention as defined in claim 4 wherein the low melting point metal is Sn.

7. The invention as defined in claim 1 wherein the thickness of the noble metal layer is between about 300 and 2,000 Angtroms.

8. The invention as defined in claim 4 wherein the thickness of each layer of the bond enhancing material is from about 100 to about 500 Angstroms.

9. The invention as defined in claim 1 wherein the noble metal is selected from the group gold, platinum and palladium.

10. The invention as defined in claim 1 wherein the low melting point metal is In, and the temperature is less then about 150°

C.

11. The invention as defined in claim 1 which said noble metal is gold.

12. The invention as defined in claim 4 wherein the bond enhancing metal is Cr.

13. The invention as defined in claim 4 wherein the bond enhancing material is Ti.

14. The invention as defined in claim 4 wherein the bond enhancing material is Al.

15. The invention as defined in claim 1 wherein the total thickness of the metals is between about 2,000 Angtroms and about 50,000 Angstroms.

16. In a bonding process wherein one crystal material is bonded to another crystal material and wherein a noble metal is deposited on one crystal and a low melting point metal is deposited on the other crystal material, the improvement comprising, depositing a layer of said nobel metal on said low melting point metal whereby to prevent oxidation of the surface thereof, and thereafter bonding said materials by application of pressure with said noble metal layers in contact with each other to form a diffusion bond between said noble metal atoms and said low melting point metal atoms.

17. The invention as defined in claim 16 wherein a layer of bond enhancing material is deposited on said other crystal below said low melting point metal.

18. The invention as defined in claim 17 wherein the bond enhancing material is selected from the group Ti, Cr and Al.

19. The invention as defined in claim 17 wherein the low melting point metal is selected from the group of tin and indium.

20. The invention as defined in claim 16 wherein the noble metal is selected from the group gold, platinum and palladium.

21. The invention as defined in claim 20 wherein the thickness of each of the layers of the noble metal is between about 300 and 2,000 Angstroms.

22. The invention as defined in claim 16 wherein the metals are vapor deposited.

23. The method of claim 19 wherein the temperature of the bonding is between about 100°

C and about 150°

C, and the low melting point metal is In.

24. The invention as defined in claim 19 wherein the temperature is between 100°

C and 200°

C and the low melting point metal is Sn.