Method of metallizing materials

• US 4,077,853 A
• Filed: 10/26/1976
• Issued: 03/07/1978
• Est. Priority Date: 03/25/1975
• Status: Expired due to Term

• Current Assignee: Brent Chemicals Corporation
• Original Assignee: Stauffer Chemical Company (Nouryon BV)
• Inventors: Coll-Palagos, Miguel
• Primary Examiner(s): Tufariello, T. M.
• Application Number:
  US05/735,242
• Time in Patent Office: 497 Days
• Field of Search: 204/11, 204/20, 204/22, 204/24, 204/37 R, 204/30, 427/383, 427/404, 427/304, 427/306
• US Class Current: 205/75
• CPC Class Codes: C23C 18/1635 Composition of the substrate
• CPC Class Codes: C23C 18/1644 porous substrates
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: C23C 18/1692 Heat-treatment
• CPC Class Codes: C23C 18/2066 Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
• CPC Class Codes: H01M 4/80 Porous plates, e.g. sintered carriers
• CPC Class Codes: H01M 4/806 Nonwoven fibrous fabric containing only fibres
• CPC Class Codes: H01M 4/808 Foamed, spongy materials
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10T 428/24999 Inorganic

Abstract

A method of metallizing materials by coating a substrate material with a hydrophilic composite material; chemically plating said hydrophilic composite material with a metal to render the surface conductive; followed by electroplating a metal onto the conductive surface. The method can be, for example, utilized to produce metallized foams, embossing plates for reproduction of grains and textures, and decorative coatings for substrate materials.

Claims

1. A method of metallizing a substrate material comprising the steps of:

a. coating said substrate material with a coating having a thickness from about 0.05 mils to about 5 mils of a non-conductive hydrophilic composite material comprised of a blend of (1) at least one film forming component, and (2) at least one water-insoluble hydrophilic component wherein the weight ratio of the film forming component to the hydrophilic component is from about 3;

10 to about 10;

1 and said components can be dissolved in a solvent without phase separation;

b. plating said hydrophilic composite material with a conductive metal by electroless metal plating;

c. electroplating a metal onto the electrolessly plated metal.

2. The method of claim 1 wherein said substrate material is a cellular material comprised of a three-dimensional network having macroscopic, interconnected cells therein.

3. The method of claim 1 wherein said substrate material is a solid organic material.

4. The method of claim 3 comprising the further step of pyrolyzing the metallized substrate material.

5. The method of claim 1 wherein said hydrophilic composite material further comprises at least one water-soluble polymeric component in a weight ratio from about 1:

10 to about 2;

1 to the weight of the film forming component.

6. A method of making an embossing plate comprising the steps of:

a. coating a textured substrate material with a coating having a thickness from about 0.05 mils to about 5 mils of a non-conductive hydrophilic composite material comprised of a blend of (1) at least one film forming component, and (2) at least one water-insoluble hydrophilic component wherein the weight ratio of the film forming component to the hydrophilic component is from about 3;

10 to about 10;

1 and said components can be dissolved in a solvent without phase separation;

b. plating said hydrophilic composite material with a conductive metal by electroless metal plating;

c. electroplating a metal onto the electrolessly plated metal; and

d. removing said textured substrate material from the metal.

7. The method of claim 6 wherein said hydrophilic composite material further comprises at least one water-soluble polymeric component in a weight ratio from about 1:

10 to about 2;

1 to the weight of the film forming component.