Methods of and apparatus for sorting parts of a separated article

• US 4,085,038 A
• Filed: 12/15/1976
• Issued: 04/18/1978
• Est. Priority Date: 12/15/1976
• Status: Expired due to Term

• Current Assignee: AT&T, Inc.
• Original Assignee: Western Electric Co., Inc. (Nokia Corporation)
• Inventors: Esseluhn, Werner F.
• Primary Examiner(s): Knowles, Allen N.
• Application Number:
  US05/750,943
• Time in Patent Office: 489 Days
• Field of Search: 209/71, 209/72, 209/74, 209/122, 209/123, 209/126, 156/584
• US Class Current: 209/606
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304

Abstract

A wafer is mounted upon a substrate and separated into individual chips which are retained on the substrate. The separated wafer and substrate are then placed on a demounting device with a passageway such that the chips on a first portion of the wafer lie over the passageway while chips on a second portion of the wafer do not. When the separated wafer is subsequently subjected to a demounting force, the chips will demount from the substrate with the chips on the first portion falling into a catch bin located in the passageway while chips on the second portion are discarded. Additional demounting devices can be provided within the passageway, if further sorting of the chips on the first portion of the separated wafer is desired.

Claims

1. A method of sorting parts of an article which has been mounted onto a carrier and separated into a plurality of individual parts which are retained on the carrier comprising:

positioning the separated article and the carrier adjacent to a passageway so that the parts of a first portion of the separated article lie over the passageway while the parts of a second portion of the separated article lie outside of the passageway; and

subjecting the separated article to a force for demounting the parts of the first portion of the separated article from the carrier to permit such parts to enter into the passageway.

2. A method as set forth in claim 1 wherein the demounting force is provided by a demounting fluid.

3. A method as set forth in claim 2 wherein the demounting fluid is a liquid.

4. A method as set forth in claim 2 wherein the demounting fluid is a vapor.

5. A method as set forth in claim 1 further comprising the step of:

applying a vibratory motion to the separated article and the carrier after the separated article has been subjected to the demounting force.

6. A method as set forth in claim 1, wherein the passageway is a first passageway, further comprising the step of:

directing a portion of the chips of the first portion of the separated article into an additional passageway which is located within the first passageway.

7. A method of sorting parts of an article comprising:

mounting the article onto a carrier;

separating the article into a plurality of individual parts with the individual parts remaining mounted on the carrier;

positioning the separated article and the carrier adjacent to a passageway so that the parts of a first portion of the separated article lie over the passageway while the parts of a second portion of the separated article lie outside of the passageway; and

subjecting the separated article to a force for demounting the parts of the first portion of the separated article from the carrier to permit such parts to enter into the passageway.

8. A method as set forth in claim 7 wherein mounting the article is accomplished by a chemically soluble cement.

9. A method as set forth in claim 8 wherein the separating is accomplished by cutting completely through the article and the chemically soluble cement into the surface of the carrier.

10. A method as set forth in claim 7 further comprising the step of:

applying a vibratory motion to the separated article and the carrier after the separated article has been subjected to the demounting force.

11. An apparatus for sorting parts of an article which has been mounted onto a carrier and separated into a plurality of individual parts which are retained on the carrier comprising:

means for providing a passageway;

means for supporting the separated article and the carrier with the separated article being located adjacent to the means for providing a passageway so that the parts of a first portion of the separated article lie over the passageway while the parts of a second portion of the separated article lie outside the passageway; and

means for subjecting the separated article to a force for demounting the parts on the first portion of the separated article from the carrier to enter into the passageway.

12. The apparatus of claim 11 wherein the supporting means is a continuous narrow edge surrounding the passageway and contacting the separated article so that the parts on the second portion of the separated article extend beyond the continuous narrow edge and will fall outside of the passageway when the separated article is subjected to the demounting force.

13. The apparatus of claim 12 further including means for applying a vibratory force to the separated article and carrier after the separated article has been subjected to the demounting force to urge parts which are retained on the continuous narrow edge to become dislodged therefrom.

14. The apparatus of claim 12 wherein the article has a peripheral edge which is of the same configuration as the continuous narrow edge.

15. The apparatus of claim 11, wherein the passageway is a first passageway, which further comprises means for providing at least one secondary passageway located within the first passageway to further sort the chips which fall into the first passageway.

16. The apparatus of claim 15 wherein the secondary passageway is concentric with the first passageway.

17. The apparatus of claim 11 which further comprises means for restraining lateral movement of the separated article and the carrier.

18. The apparatus of claim 17 wherein the means for restraining lateral movement comprises a plurality of pins located adjacent to the carrier.

19. The apparatus of claim 11 wherein the means for subjecting the separated article to the demounting force is a demounting fluid.

20. The apparatus of claim 11 further comprising a bin located in the passageway for catching the parts from the first portion of the separated article which fall into the passageway.

21. A method of sorting chips of a semiconductor wafer which has been mounted onto a substrate and separated into a plurality of individual chips which are retained on the substrate comprising:

positioning the separated wafer and the substrate adjacent to a passageway so that the chips of a first portion of the separated wafer lie over the passageway while the chips of a second portion of the separated wafer lie outside of the passageway; and

subjecting the separated wafer to a force for demounting the chips of the first portion of the separated wafer from the substrate to permit such chips to enter into the passageway.

22. A method as set forth in claim 21 wherein the wafer is mounted onto the substrate by a soluble cement and the step of subjecting the wafer to a demounting force comprises exposing the wafer and substrate to a demounting fluid to dissolve the soluble cement.

23. An apparatus for sorting chips of a semiconductor wafer which has been mounted onto a substrate and separated into a plurality of individual chips which are retained on the substrate comprising:

means for providing a passageway;

means for supporting the separated wafer and the substrate with the separated wafer being located adjacent to the means for providing a passageway so that the chips of a first portion of the separated wafer lie over the passageway while the chips of a second portion of the separated wafer lie outside the passageway; and

means for subjecting the separated wafer to a force for demounting the chips on the first portion of the separated wafer from the substrate to enter into the passageway.

24. The apparatus of claim 23 wherein the wafer is mounted onto the substrate by a soluble cement and the means for subjecting the separated wafer to a demounting force comprises a demounting fluid to dissolve the soluble cement.