Composite and method for making thin copper foil

• US 4,088,544 A
• Filed: 04/19/1976
• Issued: 05/09/1978
• Est. Priority Date: 04/19/1976
• Status: Expired due to Term

• Current Assignee: Irving J. Hutkin
• Original Assignee: Irving J. Hutkin
• Inventors: Hutkin, Irving J.
• Primary Examiner(s): Tufariello, T. M.
• Application Number:
  US05/678,197
• Time in Patent Office: 750 Days
• Field of Search: 204/12, 204/13, 204/281, 204/208
• US Class Current: 428/545
• CPC Class Codes: C25D 1/04 Wires; Strips; Foils
• CPC Class Codes: C25D 1/22 Separating compounds
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 2203/0307 Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• CPC Class Codes: H05K 2203/0723 Electroplating, e.g. finish plating
• CPC Class Codes: H05K 2203/0726 Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: Y10T 428/12007 Component of composite having metal continuous phase interengaged with nonmetal continuous phase
• CPC Class Codes: Y10T 428/12569 Synthetic resin
• CPC Class Codes: Y10T 428/12736 Al-base component

Abstract

The improved method of the invention comprises disposing a chromium oxide release layer on the surface of a thin inexpensive metal carrier, such as foil, depositing copper on the release layer to form a thin copper foil, and readily peeling the thus-formed copper foil from the release layer on the carrier. The release layer can be formed in situ from chromium metal electroplated on the carrier. The freshly prepared release layer contains numerous small sites on which electroplating of the copper can be easily carried out to produce pore-free copper foil. The method, which employs the carrier-release layer composite of the invention, is inexpensive and efficient, since readily available, inexpensive metal carriers can be used and no complicated copper foil-carrier separation steps need be resorted to. Moreover, it can increase the bondability of the thin copper foil thus produced to plastic during lamination thereof.

Claims

1. An improved method of making a thin, substantially pore-free copper foil, which method comprises:

a. disposing on the surface of a thin aluminum metal carrier a thin layer of zinc or tin;

b. disposing on said layer of zinc or tin a thin chromium release layer containing a plurality of plating sites;

c. depositing a copper layer on said release layer to form a thin, substantially pore-free copper foil;

d. bonding the exposed face of said copper foil to a substrate to form a laminate; and

e. separating said release layer from said foil.

2. The improved method of claim 1 wherein said release layer is formed in situ and wherein said copper is deposited on said release layer substantially immediately after it is rinsed and wherein said rinsing is effected substantially immediately after said formation in situ.

3. The improved method of claim 1 wherein said release layer is electroplated on said metal carrier surface and wherein said carrier is foil.

4. The improved method of claim 3 wherein said release layer has a thickness of about 20-500 microinches and wherein said substrate comprises plastic.

5. The improved method of claim 1 wherein said metal carrier surface is roughened sufficiently to increase the bondability of said copper foil to plastic.

6. The improved method of claim 3 whereby said carrier surface is roughened by etching.

7. The improved method of claim 1 wherein said carrier is about 1-20 mils thick and wherein said copper foil, together with said carrier and release layer, are cut to predetermined size before said laminating.

8. The improved method of claim 4 wherein said carrier comprises aluminum foil about 1-20 mils thick, wherein said aluminum surface is etched and zincated before said release layer is electroplated thereon and wherein said copper is electroplated on said release layer to a thickness of less than about 0.5 oz. per sq. ft. to form said copper foil.

9. The improved method of claim 8 and further including the deposition of a thin layer of copper and copper oxide nodules on said copper layer, to enhance the bondability of said layer to plastic.

10. An improved unitary composite comprising, in combination:

a. a thin aluminum carrier having a roughened surface;

b. a thin metallic layer selected from the group consisting of tin and zinc disposed on said roughened surface;

c. a release layer of metal selected from the group consisting of chromium, nickel and cobalt on the surface of said metallic layer;

d. a thin copper foil layer disposed on said release layer;

e. a layer of copper and copper oxide nodules disposed on said copper foil layer to enhance its bondability to plastic; and

,

f. a plastic substrate bonded to said layer of copper and copper oxide nodules.

11. An improved unitary composite comprising, in combination:

a. a thin aluminum carrier;

b. a thin metallic zinc or tin layer disposed on said aluminum carrier;

c. a chromium release layer deposited on the surface of said zinc layer; and

d. a thin copper foil disposed on said release layer.

12. The improved composite of claim 11 wherein said aluminum carrier has a roughened surface.

13. The improved composite of claim 12, and further including a layer of copper and copper oxide nodules disposed on said copper layer to enhance bondability of said copper layer to plastic.

14. The improved composite of claim 11 and further including a substrate suitable for a printed circuit laminated to said copper foil.

15. The improved composite of claim 13 and further including a substrate laminated to said layer of copper and copper oxide nodules.

16. The improved composite of claim 11 wherein said release layer is about 20-500 microinches thick.

17. The improved composite of claim 11 wherein said aluminum is about 1-20 mils thick.