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Circuit board and method for producing same

  • US 4,091,125 A
  • Filed: 11/08/1976
  • Issued: 05/23/1978
  • Est. Priority Date: 11/08/1976
  • Status: Expired due to Term
First Claim
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1. A process for producing an electrical circuit board comprising the steps of:

  • selectively roughening a portion of the surface of a conductive metal sheet in a pattern substantially corresponding to a pre-determined conductive circuit configuration which roughened surfaces renders the pattern portion essentially adherent to a resin;

    placing the roughened pattern portion of the metal sheet in direct contact with a uniform layer of resin on the surface of an insulating substrate to form an assembly;

    heating the assembly to an elevated temperature to soften the resin such that the resin wets and adheres to the roughened pattern portion of the metal sheet whereby the substrate is selectively bonded to the roughened pattern portion of the metal sheet;

    punch cutting the sheet along the perimeter of the pattern portions; and

    stripping the non-pattern portions of the metal sheet from the substrate to form a conductive circuit board.

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