Circuit board and method for producing same
First Claim
1. A process for producing an electrical circuit board comprising the steps of:
- selectively roughening a portion of the surface of a conductive metal sheet in a pattern substantially corresponding to a pre-determined conductive circuit configuration which roughened surfaces renders the pattern portion essentially adherent to a resin;
placing the roughened pattern portion of the metal sheet in direct contact with a uniform layer of resin on the surface of an insulating substrate to form an assembly;
heating the assembly to an elevated temperature to soften the resin such that the resin wets and adheres to the roughened pattern portion of the metal sheet whereby the substrate is selectively bonded to the roughened pattern portion of the metal sheet;
punch cutting the sheet along the perimeter of the pattern portions; and
stripping the non-pattern portions of the metal sheet from the substrate to form a conductive circuit board.
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Accused Products
Abstract
There is disclosed a method for producing an electrical circuit board comprising the steps of selectively treating a portion of a conductive metal sheet in a pattern substantially corresponding to a predetermined printed circuit configuration and in a manner which renders the pattern portion of the sheet essentially adherent to a resin, placing the treated pattern portion of the sheet in direct contact with a layer of resin on the surface of an insulating substrate to form an assembly, uniformily heating the assembly to an elevated temperature to selectively bond the substrate to the treated pattern portion of the sheet, cutting the sheet along the perimeter of the pattern portions and stripping the non-pattern portions of the sheet from the substrate to form a circuit board.
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Citations
15 Claims
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1. A process for producing an electrical circuit board comprising the steps of:
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selectively roughening a portion of the surface of a conductive metal sheet in a pattern substantially corresponding to a pre-determined conductive circuit configuration which roughened surfaces renders the pattern portion essentially adherent to a resin; placing the roughened pattern portion of the metal sheet in direct contact with a uniform layer of resin on the surface of an insulating substrate to form an assembly; heating the assembly to an elevated temperature to soften the resin such that the resin wets and adheres to the roughened pattern portion of the metal sheet whereby the substrate is selectively bonded to the roughened pattern portion of the metal sheet; punch cutting the sheet along the perimeter of the pattern portions; and stripping the non-pattern portions of the metal sheet from the substrate to form a conductive circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification