Method of selectively depositing a metal on a surface of a substrate
First Claim
1. A method of selectively depositing a metal on a surface of a substrate which comprises:
- (a) treating the surface with a desensitizer comprising hydrazine;
(b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to render a selected area thereof incapable of desensitizing a sensitizing species; and
(c) treating said radiation-exposed surface with a sensitizing species to sensitize said selected area.
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Accused Products
Abstract
A method of selectively depositing a metal on a surface of a substrate is disclosed. A suitable substrate is selected and a surface is treated with a desensitizer selected from the group consisting of (a) hydrazine, (b) a substituted hydrazine having the structural formula ##STR1## where R1 is an organic radical selected from the group consisting of alkyl, cycloalkyl, aryl, alkaryl, aralkyl, alkoxy, aryloxy and heterocyclic radicals and R2, R3 and R4 are the hydrogen radical or are the same as R1, and (c) a mixture of the foregoing. The desensitizer-treated surface is selectively exposed to a source of ultraviolet radiation to render selected areas thereof incapable of desensitizing a sensitizing species. The radiation-exposed surface is treated with a sensitizing species to sensitize the selected areas.
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Citations
18 Claims
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1. A method of selectively depositing a metal on a surface of a substrate which comprises:
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(a) treating the surface with a desensitizer comprising hydrazine; (b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to render a selected area thereof incapable of desensitizing a sensitizing species; and (c) treating said radiation-exposed surface with a sensitizing species to sensitize said selected area. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of forming an activated pattern on a surfaced of a substrate, the pattern being usable to catalyze and reduce thereon an electroless metal deposit from an electroless metal deposition solution, which comprises:
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(a) treating the surface with a desensitizer comprising hydrazine; (b) exposing a selected portion of said desensitizer-treated surface to a source of ultraviolet radiation to delineate an exposed pattern corresponding to the activated pattern, (c) treating said ultraviolet radiation-exposed surface to a sensitizer to sensitize said exposed pattern, and (d) exposing said sensitized pattern to an activator to form the activated pattern. - View Dependent Claims (8, 9)
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10. A method of producing an electrical circuit pattern on a non-conductive substrate, which comprises:
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(a) treating a surface of the substrate with a desensitizer comprising hydrazine; (b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to form an exposed pattern corresponding to the electrical circuit pattern; (c) treating said radiation-exposed surface with a sensitizer to sensitize said exposed pattern; and (d) activating the sensitized pattern to form an activated pattern. - View Dependent Claims (11, 12, 13)
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14. A method of selectively depositing a metal on a dielectric surface which comprises selectively treating the surface with a desensitizer comprising hydrazine to delineate an untreated surface pattern which is capable of participating in an electroless metal deposition process.
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15. A method of selectively depositing a metal on a dielectric surface which comprises:
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treating the surface with an electroless metal deposition sensitizer to sensitize the surface, and selectively coating said sensitized surface with a desensitizer comprising hydrazine to delineate a sensitized pattern thereon. - View Dependent Claims (16, 17, 18)
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Specification