Method of selectively depositing a metal on a surface of a substrate

• US 4,096,043 A
• Filed: 07/11/1977
• Issued: 06/20/1978
• Est. Priority Date: 07/11/1977
• Status: Expired due to Term

• Current Assignee: AT&T Technologies Inc (Nokia Corporation)
• Original Assignee: Western Electric Co., Inc. (Nokia Corporation)
• Inventors: De Angelo, Michael Anthony
• Primary Examiner(s): Tufariello, T. M.
• Application Number:
  US05/814,564
• Time in Patent Office: 344 Days
• Field of Search: 204/15, 204/20, 204/30, 427/98, 427/304, 427/305, 427/306, 96/38.4
• US Class Current: 205/118
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/1612 through irradiation means
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: C23C 18/285 Sensitising or activating with tin based compound or composition
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: H05K 3/185 by making a catalytic pattern by photo-imaging
• CPC Class Codes: Y10S 205/918 Use of wave energy or electrical discharge during pretreatment of substrate or post-treatment of coating

Abstract

A method of selectively depositing a metal on a surface of a substrate is disclosed. A suitable substrate is selected and a surface is treated with a desensitizer selected from the group consisting of (a) hydrazine, (b) a substituted hydrazine having the structural formula ##STR1## where R₁ is an organic radical selected from the group consisting of alkyl, cycloalkyl, aryl, alkaryl, aralkyl, alkoxy, aryloxy and heterocyclic radicals and R₂, R₃ and R₄ are the hydrogen radical or are the same as R₁, and (c) a mixture of the foregoing. The desensitizer-treated surface is selectively exposed to a source of ultraviolet radiation to render selected areas thereof incapable of desensitizing a sensitizing species. The radiation-exposed surface is treated with a sensitizing species to sensitize the selected areas.

Claims

1. A method of selectively depositing a metal on a surface of a substrate which comprises:

(a) treating the surface with a desensitizer comprising hydrazine;

(b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to render a selected area thereof incapable of desensitizing a sensitizing species; and

(c) treating said radiation-exposed surface with a sensitizing species to sensitize said selected area.

2. The method as defined in claim 1 which further comprises:

exposing at least said sensitizing area to an activating solution to activate said area.

3. The method as defined in claim 2 which further comprises:

exposing said activated area to an electroless metal deposition solution to deposit an electroless metal thereon.

4. The method as defined in claim 3 which further comprises electroplating said electroless metal deposit.

5. The method as defined in claim 1 wherein said sensitizing species comprises a Sn⁺ 2 species.

6. The method as defined in claim 1 wherein said substrate surface comprises a polyimide.

7. A method of forming an activated pattern on a surfaced of a substrate, the pattern being usable to catalyze and reduce thereon an electroless metal deposit from an electroless metal deposition solution, which comprises:

(a) treating the surface with a desensitizer comprising hydrazine;

(b) exposing a selected portion of said desensitizer-treated surface to a source of ultraviolet radiation to delineate an exposed pattern corresponding to the activated pattern,

(c) treating said ultraviolet radiation-exposed surface to a sensitizer to sensitize said exposed pattern, and

(d) exposing said sensitized pattern to an activator to form the activated pattern.

8. The method as defined in claim 7 wherein:

said sensitizer comprises a stannous species, and said activator comprises a Pd⁺² species.

9. The method as defined in claim 7 wherein said surface comprises a polyamide.

10. A method of producing an electrical circuit pattern on a non-conductive substrate, which comprises:

(a) treating a surface of the substrate with a desensitizer comprising hydrazine;

(b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to form an exposed pattern corresponding to the electrical circuit pattern;

(c) treating said radiation-exposed surface with a sensitizer to sensitize said exposed pattern; and

(d) activating the sensitized pattern to form an activated pattern.

11. The method as defined in claim 10 which further comprises:

treating said activated pattern with an electroless metal deposition solution to deposit on electroless metal deposit thereon.

12. The method as defined in claim 10 wherein:

said sensitizer comprises a tin species.

13. The method as defined in claim 10 wherein said surface comprises a polyimide.

14. A method of selectively depositing a metal on a dielectric surface which comprises selectively treating the surface with a desensitizer comprising hydrazine to delineate an untreated surface pattern which is capable of participating in an electroless metal deposition process.

15. A method of selectively depositing a metal on a dielectric surface which comprises:

treating the surface with an electroless metal deposition sensitizer to sensitize the surface, and

selectively coating said sensitized surface with a desensitizer comprising hydrazine to delineate a sensitized pattern thereon.

16. The method as defined in claim 15 which further comprises exposing at least said sensitized pattern to an activating solution to activate said pattern.

17. The method as defined in claim 16 which further comprises treating said activated pattern with an electroless metal deposition solution to deposit an electroless metal thereon.

18. The method as defined in claim 17 which further comprises electroplating said electroless metal deposit.