Method of making a negative photoresist image
First Claim
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1. A method of making a negative photoresist image on a substrate consisting essentially of the steps of:
- Applying to a substrate a layer of a positive working photoresist material consisting essentially of a phenolformaldehyde resin, a naphthoquinone (1,2) diazide sulfonic acid ester sensitizer, and a 1-hydroxyethyl-2-alkylimidazoline,imagewise exposing the layer with actinic radiation,heating the imagewise exposed layer for a sufficient period of time to a sufficient temperature to render the exposed areas insoluble in alkaline developer,subsequently blanket exposing the layer with actinic radiation and, removing the portions of the layer which were not exposed during the imagewise exposure with an alkaline developer.
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Abstract
The invention relates to a method of making a negative photoresist image on a substrate, where a normally positive working photoresist material containing 1-hydroxyethyl-2-alkyl-imidazoline is applied to a substrate, image-wise exposed with actinic radiation, heated, and blanket exposed to actinic radiation. The material which was not exposed originally is then removed with a solvent to give a negative image.
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Citations
5 Claims
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1. A method of making a negative photoresist image on a substrate consisting essentially of the steps of:
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Applying to a substrate a layer of a positive working photoresist material consisting essentially of a phenolformaldehyde resin, a naphthoquinone (1,2) diazide sulfonic acid ester sensitizer, and a 1-hydroxyethyl-2-alkylimidazoline, imagewise exposing the layer with actinic radiation, heating the imagewise exposed layer for a sufficient period of time to a sufficient temperature to render the exposed areas insoluble in alkaline developer, subsequently blanket exposing the layer with actinic radiation and, removing the portions of the layer which were not exposed during the imagewise exposure with an alkaline developer. - View Dependent Claims (2, 3, 4, 5)
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Specification