Method and apparatus for lapping or polishing materials

• US 4,104,099 A
• Filed: 01/27/1977
• Issued: 08/01/1978
• Est. Priority Date: 01/27/1977
• Status: Expired due to Term

• Current Assignee: ITT Corporation (ITT, Inc.)
• Original Assignee: International Telephone & Telegraph Corp. (ITT, Inc.)
• Inventors: Scherrer, Raymond E.
• Primary Examiner(s): Klein, David
• Assistant Examiner(s): Gallagher, J. J.
• Application Number:
  US05/763,451
• Time in Patent Office: 551 Days
• Field of Search: 156/154, 156/155, 156/212, 156/314, 156/247, 156/326, 156/297, 156/344, 156/309, 156/299, 156/153, 427/407 R, 427/416, 29/423, 29/424, 269/7, 269/289 R, 269/321 WE, 51/216 R, 51/277, 51/281 R, 51/3.7
• US Class Current: 156/155
• CPC Class Codes: B24B 37/32 Retaining rings
• CPC Class Codes: G03F 7/0012 Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
• CPC Class Codes: H01L 21/02013 Grinding, lapping
• CPC Class Codes: Y10S 156/922 Specified electronic component delaminating in preparation for recycling
• CPC Class Codes: Y10S 269/903 Work holder for electrical circuit assemblages or wiring systems
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 29/4981 Utilizing transitory attached element or associated separate material
• CPC Class Codes: Y10T 29/49812 Temporary protective coating, impregnation, or cast layer

Abstract

Wafers to be processed are mounted to a lapping plate of a lapping machine using a photosensitive thermoplastic material, such as a photoresist. In a preferred embodiment, the wafers are laminated to a dry film photopolymer disposed on a carrier sheet, after which the sheet is secured to the lapping plate using a pressed-fit hoop that stretches the carrier sheet across the surface of the lapping plate and holds the sheet secure about the perimeter of the plate.

Claims

1. A method for mounting material to be processed to a supporting surface of a processing apparatus wherein a selected surface of the material is to be protected, comprising the steps of:

applying a protective coating to the selected surface of the material; and

disposing a temperature-sensitive material between the protective coating and the supporting surface for securing the coating to said surface, whereby the protective coating protects the selected surface of the material during the processing and from solvents used to remove the temperature-sensitive material.

2. A method as described in claim 1, wherein the temperature sensitive material comprises a wax and the disposing step includes the steps of:

applying the wax to the supporting surface;

heating the wax to its melting point;

placing the selected surface with protective coating on the melted wax; and

cooling the wax until it solidifies, thereby securing the material to the supporting surface.

3. A method for mounting a semiconductor wafer to the surface of a lapping plate in such a manner as to protect the front face of the wafer during the lapping operation, comprising the steps of:

laminating the front face of said semiconductor wafer to a dry film photopolymer disposed on a carrier sheet; and

securing said carrier sheet over the surface of said lapping plate.

4. A method for mounting material to be processed to a supporting surface of a processing apparatus wherein a selected surface of the material is to be protected, comprising the steps of:

applying a layer of polymer material to the selected surface of the material; and

securing said layer of polymer material to the supporting surface.

5. A method for mounting material to be processed to a supporting surface of a processing apparatus wherein a selected surface of the material is to be protected, comprising the steps of:

applying a layer of photoresist material to the selected surface of the material; and

securing said layer of photoresist material to the supporting surface.

6. A method as described in claim 5, wherein the layer of photoresist material is secured to the supporting surface using wax.

7. A method for mounting material to be processed to a supporting surface of a processing apparatus wherein a selected surface of the material is to be protected, comprising the steps of:

applying a dry film polymer disposed on a carrier sheet to the selected surface of the material by heat laminating the polymer to the selected surface; and

securing the carrier sheet to the supporting surface.

8. A method as described in claim 7, wherein the material to be processed comprises a wafer that is attached to the dry film polymer and the carrier sheet by passing the wafer, dry film polymer and the carrier sheet through a heat laminating apparatus.

9. A method as described in claim 8, wherein the wafer is first placed on a template with the selected surface facing upwardly and the template and wafer are passed through the laminating apparatus for applying the dry film polymer to the selected surface of the wafer.

10. A method as described in claim 7, wherein the carrier sheet is mounted to the supporting surface utilizing a wax.

11. A method as described in claim 7, wherein the carrier sheet is mounted to the supporting surface by folding the sheet downwardly about a periphery of the surface and applying a securing means about the periphery of the surface to securely engage the carrier sheet about the periphery of the supporting surface.

12. A method as described in claim 11, wherein the carrier sheet is secured about the periphery of the supporting surface by applying an elastomeric ring about said periphery.

13. A method as described in claim 11, wherein the supporting surface is circular and is defined by a cylindrical peripheral surface and the carrier sheet is folded downwardly about the cylindrical surface and is secured thereto by a press-fit annular ring.

14. A method as described in claim 7, additionally comprising the steps of:

forming a plurality of openings in said carrier sheet;

orientating said openings so as to be in registration with adjusting screws protruding above the supporting surface; and

securing the periphery of said openings to the supporting surface.

15. A method as described in claim 7, wherein the polymer is a photopolymer.