Chuck for use in the testing of semiconductor wafers

• US 4,104,589 A
• Filed: 10/07/1976
• Issued: 08/01/1978
• Est. Priority Date: 10/07/1976
• Status: Expired due to Term

• Current Assignee: RCA Corporation
• Original Assignee: RCA Corporation
• Inventors: Baker, Robert Lee, Mahoski, Calvin Michael, Partilla, John David, Ronan, Harold Robert Jr.
• Primary Examiner(s): Rolinec, Rudolph V.
• Assistant Examiner(s): Karlsen, Ernest F.
• Application Number:
  US05/730,332
• Time in Patent Office: 663 Days
• Field of Search: 324/158 F, 324/158 P, 324/72.5, 339/117 P, 269/21, 29/416, 29/624
• US Class Current: 324/756.05
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: Y10T 29/49796 Coacting pieces

Abstract

A chuck for use in the testing of semiconductor wafers comprising first and second pluralities of electrically conductive members alternately arranged to provide a wafer receiving surface. The members are substantially completely electrically isolated from each other. Electric power leads and measurement sensing leads are provided to the first plurality of conductive members and the second plurality of conductive members respectively.

Claims

1. A chuck having a wafer receiving surface for testing semiconductor wafers comprising:

a first and a second plurality of electrically conductive members, said members being alternately arranged and substantially electrically isolated from each other;

means for retaining said members together such that said wafer receiving surface is provided;

means electrically connecting said first plurality of members together;

means electrically connecting said second plurality of members together;

means for attaching power and sensing means to said first and second members connecting means, respectively; and

means, integral with said chuck for holding a semiconductor wafer to said wafer receiving surface.

2. A chuck as claimed in claim 1 further comprising:

dielectric material interspersed with said plurality of conductive members, thereby dielectrically isolating said first plurality of conductive members from said second plurality of conductive members.

3. A chuck as claimed in claim 1 wherein:

said holding means comprises a pattern of interconnected grooves within said wafer receiving surface.

4. A chuck as claimed in claim 1 wherein:

said first and second plurality of conductive members are substantially rectangular in shape.

5. A chuck as claimed in claim 1 wherein:

said wafer receiving surface is substantially circular.

6. A chuck as claimed in claim 1 wherein:

the sum of widths of the isolated adjacent members is less than the width of a given dimension of a device pellet of a wafer.

7. A chuck as claimed in claim 1 wherein:

said retaining means is a retaining ring dielectrically isolated from said conductive members.

8. A chuck as claimed in claim 1 wherein:

said connecting means are bus bars contacting said respective conductive members in a direction which is substantially perpendicular to the elongated direction thereof.

9. A method of fabricating a chuck having a wafer receiving surface comprising the steps of:

forming a plurality of slots in one face of a workpiece of conductive material;

refilling said slots with a dielectric material;

machining an opposing face of said workpiece until a first and second plurality of separate conductive members is formed, said members being alternately arranged and substantially electrically isolated from each other;

retaining said conductive members together to form said wafer receiving surface;

connecting said first plurality of members together;

connecting said second plurality of members together;

attaching power and sensing means to said first and second members respectively; and

providing means, integral with said chuck, for holding a semiconductor wafer to said wafer receiving surface.

10. A method as claimed in claim 9 wherein said providing step comprises the step of:

forming a pattern of interconnected grooves in said one face.

11. A method as claimed in claim 9 further comprising the step of:

machining said faces to a comparative parallelism on the order of about 0.001 inch.

12. A method as claimed in claim 11 further comprising the step of:

machining each of said faces such that the largest variation in thickness across each face is less than about 0.001 inch.

13. A method as claimed in claim 9 further comprising the step of:

machining said one face such that the largest variation in thickness thereof is less than about 0.001 inch.