Mounting assembly for electronic power devices

• US 4,104,701 A
• Filed: 11/22/1976
• Issued: 08/01/1978
• Est. Priority Date: 11/22/1976
• Status: Expired due to Term

• Current Assignee: Natel Engineering Company, Inc. (NEO Technology Solutions)
• Original Assignee: Powercube Corporation
• Inventors: Baranowski, Conrad J.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US05/744,137
• Time in Patent Office: 617 Days
• Field of Search: 165/80, 357/81, 174/16 HS, 361/386-389, 361/395, 361/398, 361/380
• US Class Current: 361/716
• CPC Class Codes: H01L 2023/4031 Packaged discrete devices, e.g. to-3 housings, diodes
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

An assembly for mounting electronic power devices to a flexible circuit board and in an enclosure. A slotted plastic button is mounted to the built-in heat sink portion of the power device and a spring member is mounted between two such power devices. The spring forces the heat sink surfaces of the power devices against opposite walls of the enclosure and transmits insertion forces to the flexible board during assembly.

Claims

1. A modular electronic assembly comprising:

at least one pair of electronic power devices arranged in spaced confronting relationship;

a deformable electrically insulating button mounted to each said power device, said button having a blind hole extending from one side thereof part way therethrough and a slot through said button, said slot extending radially from the axis of said blind hole; and

a spring member extending into each said blind hole, said spring member being arranged between and urging apart said power devices in each said pair of said power devices.

2. The modular electronic assembly recited in claim 1 wherein each said power device is formed with a heat sink surface on one side thereof opposite to the confronting side, said spring member urging said pair of power devices apart in a direction perpendicular to said heat sink surfaces.

3. The modular electronic assembly recited in claim 2 wherein:

each said power device is formed with a hole therein;

said button is formed with a cylindrical projection coaxial with and including the blind end of said blind hole, said slot opening through said cylindrical projection, said cylindrical projection extending into said power device hole.

4. The modular electronic assembly recited in claim 3 wherein the connection between said spring member and said blind hole in said button is a force fit and said slot permits sufficient expansion of said blind hole to accommodate tolerance variations in said spring member.

5. The modular electronic assembly recited in claim 4 wherein the connection between said hole in said power device and said cylindrical projection on said button is a force fit and said slot permits sufficient compression of said cylindrical projection to accommodate tolerance variations in said hole in said power device.

6. The modular electronic assembly recited in claim 2 and further comprising:

a flexible printed circuit board;

each said power device having leads connected to said flexible board;

said spring member being U-shaped, the bottom central portion of said U-shaped spring member bearing against the top surface of said flexible board.

7. The modular electronic assembly recited in claim 6 and further comprising:

an enclosure having spaced confronting side walls;

said heat sink surfaces being urged by said spring against the interior surfaces of said side walls, said spring transmitting forces to said flexible board when said assembly of said flexible board, power devices, buttons and spring is inserted between said side walls into said enclosure.

8. The modular electronic assembly recited in claim 7 wherein said power device leads are formed into an S-shape whereby adjustability of the position of each said power device with respect to said flexible board is provided and whereby said leads act as spring members urging one end of each said power device in a direction perpendicular to said heat sink surface.

9. The modular electronic assembly recited in claim 8 wherein said spring member is connected to each said power device adjacent the end opposite the end to which said leads are connected, whereby the combination of such spring member and said S-shaped leads urges said heat sink surface flush against said enclosure side wall.

10. A modular electronic assembly comprising:

at least one pair of electronic power devices arranged in spaced confronting relationship and having a plurality of leads extending from one end thereof;

a flexible printed circuit board, at least some of said leads being connected to said flexible board; and

a spring member coupled between and urging apart said power devices, said spring member having a central section bearing against the top surface of said flexible board;

said spring member being coupled to said power device adjacent the end opposite said leads, said leads being S-shaped to permit adjustability of the position of said power device with respect to said flexible board, said S-shaped leads acting as a spring and urging said power devices in the same direction as said spring member.

11. The modular electronic assembly recited in claim 10 and further comprising:

an enclosure having spaced confronting side walls;

said pair of power devices, flexible board, and spring member being mounted within said enclosure, said spring member and said S-shaped leads acting together to urge said power devices in surface contact with said side walls.

12. A modular electronic assembly comprising:

a flexible printed circuit board;

at least one electronic power device having a heat sink surface on one side thereof;

spring means mounted to said circuit board and coupled to said power device, said spring means urging said power device in a direction perpendicular to said heat sink surface, whereby said heat sink surface of said power device is adapted to make confronting contact with a thermally conductive adjacent surface; and

a deformable electrically insulating button mounted to said power device and coupling said spring means to said power device.

13. The modular electronic assembly recited in claim 12 wherein:

said power device is formed with a hole therein;

said button is formed with a slot therethrough and a cylindrical projection, said slot extending radially from the axis of said cylindrical projection;

said cylindrical projection extends into said hole in said power device, the connection between said button and said hole being a force fit, said slot permitting sufficient compression of said cylindrical projection to accommodate tolerance variations in said hole in said power device.

14. The modular electronic assembly recited in claim 13 wherein:

said button is formed with a blind hole coaxial with said cylindrical projection and opening into the side of said button opposite said cylindrical projection, said blind hole extending part way through said button;

said spring means having a member force fit into said blind hole, said slot permitting sufficient expansion of said blind hole to accommodate tolerance variations in said spring member.

15. A modular electronic assembly comprising:

a flexible printed circuit board;

a first electronic power device having a heat sink surface on one side thereof;

a second power device having a heat sink surface on one side thereof and spaced from said first power device in confronting relationship; and

spring means mounted to said circuit board and coupled to said power devices, said spring means comprising a U-shaped wire having the bottom central portion bearing against the top surface of said flexible board, said spring wire engaging both said power devices and urging them apart in a direction perpendicular to said heat sink surface, whereby said heat sink surface of each said power device is adapted to make confronting contact with a thermally conductive adjacent surface.

16. The modular electronic assembly recited in claim 15 and further comprising:

an enclosure having spaced confronting side walls;

both said power devices, spring means and flexible board being mounted within said enclosure with said power devices being in surface contact with opposite side walls of said enclosure and being urged thereagainst by said spring means.

17. A modular electronic assembly comprising:

a flexible printed circuit board;

at least one electronic power device having a heat sink surface on one side thereof;

spring means mounted to said circuit board; and

deformable coupling means mounted to said power device and coupling said spring means to said power device, said spring means urging said power device in a direction perpendicular to said heat sink surface, whereby said heat sink surface of said power device is adapted to make confronting contact with a thermally conductive adjacent surface.