Machine for changing the spacing of a plurality of wafers
First Claim
Patent Images
1. A machine comprising:
- a plurality of wafer receiving surfaces, said wafer receiving surfaces initially having a first spacing associated therewith;
a base having a top surface above which said wafer receiving surfaces extend,each said wafer receiving surface being at a different height above said top surface than every other wafer receiving surface; and
means cooperatively engaged with said surfaces for changing said first spacing to a second spacing.
0 Assignments
0 Petitions
Accused Products
Abstract
A machine for changing the spacing of a plurality of wafers comprises a plurality of wafer receiving surfaces initially having a first spacing associated therewith. The wafer receiving surfaces cooperatively engage with means which, when activated, move the plurality of wafer receiving surfaces so that they have a second spacing associated therewith.
-
Citations
9 Claims
-
1. A machine comprising:
-
a plurality of wafer receiving surfaces, said wafer receiving surfaces initially having a first spacing associated therewith; a base having a top surface above which said wafer receiving surfaces extend, each said wafer receiving surface being at a different height above said top surface than every other wafer receiving surface; and means cooperatively engaged with said surfaces for changing said first spacing to a second spacing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
Specification