Connector with printed wiring board structure

• US 4,109,298 A
• Filed: 07/26/1976
• Issued: 08/22/1978
• Est. Priority Date: 07/26/1976
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Johnson, Dudley B., Hanni, Stephen L.
• Primary Examiner(s): Smith, Jr., David
• Application Number:
  US05/708,502
• Time in Patent Office: 757 Days
• Field of Search: 361/412, 361/406, 339/176 MP, 339/17 L, 339/17 LM, 339/17 LC, 339/17 M, 174/68.5
• US Class Current: 361/803
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/048 Second PCB mounted on first PCB by inserting in window or holes of the first PCB
• CPC Class Codes: H05K 2201/09172 Notches between edge pads
• CPC Class Codes: H05K 2201/09645 Patterning on via walls; Plural lands around one hole
• CPC Class Codes: H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending rigid circuit boards or rigid supports locally made bendable H05K1/0278
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/36 Assembling printed circuits with other printed circuits H05K7/142 takes precedence
• CPC Class Codes: H05K 3/365 by abutting, i.e. without alloying process
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence
• CPC Class Codes: Y10S 439/931 Conductive coating

Abstract

An improved connector having a printed wiring board structure and integrally connected to a printed wiring board. The connectors are suitable for use as part of a printed wiring board having a metal substrate. The connectors are finger-like structures, which mate either with other finger-like structures or with apertures in a printed wiring board. Both soldered and solderless connectors are disclosed.

Claims

1. A printed wiring board connector, comprising:

(a) a first sheet metal substrate including at least two finger-like projections extending outwardly from the central portion of said first substrate;

(b) a first layer of insulating material covering said first substrate including said finger-like projections and the peripheral edge of said sheet metal substrate, said insulating material further extending outwardly of said first substrate in the area between said at least two finger-like projections;

(c) a first layer of conductive material affixed to selected areas of said first layer of insulating material and said at least two finger-like projections;

(d) a second layer of conductive material affixed to said first layer of insulating material at the peripheral edge of said first sheet metal substrate, including the peripheral edge of the insulating material extending outwardly of the first substrate;

(e) notch means for severing said second layer of conductive material between said at least two finger-like projections, said notch means confronting the insulating material extending outwardly of the first substrate;

(f) a second substrate having at lest two apertures for receiving said at least two finger-like projections;

(g) a second layer of insulating material covering, at least in part, said second substrate; and

(h) a third layer of conductive material affixed to said second layer of insulating material covering at least part of the peripheral area of said apertures, for making electrical contact with said first layer of conductive material when said finger-like projections, are inserted into said apertures.

2. The connector according to claim 1, where said second substrate is sheet metal.

3. The connector according to claim 1, where said finger-like projections include first and second portions, the first portion being of greater cross-sectional area than the second portion.

4. The connector according to claim 3, wherein said second layer of insulating material covers the hole forming walls of said aperture in said second substrate and wherein said third layer of conductive meterial is affixed to said second layer of insulating material covering the hole forming walls of said aperture.

5. The connector according to claim 1, wherein said projections are of a sufficient width to accommodate a plurality of conductors formed by said first layer of conductive material, said plurality of conductors being disposed on a single major surface of said projection.

6. The connector according to claim 1, wherein said first layer of conductive material is affixed to one major surface of said first layer of insulating material covering said substrate including finger-like projections and further including a fourth layer of conductive material affixed to another major surface of said first layer of insulating material.

7. The connector according to claim 6, wherein said third layer of conductive material is separated into two spaced apart portions each affixed to a selected portion of the peripheral area of said aperture.

8. The connector according to claim 1, further including:

(a) a third substrate having a finger-like projection extending outwardly from the central portion of said third substrate;

(b) a third layer of insulating material covering said third substrate including the finger-like projection eminating therefrom;

(c) a fourth layer of conductive material affixed to selected areas of said third layer of insulating material and said projection eminating from the central portion of said third substrate;

(d) wherein said second substrate includes another aperture for receiving the finger-like projection eminating from the central area of said third substrate; and

(e) wherein said finger-like projections eminating from the central portions of said first and third substrates are disposed in a plane essentially at a right angle to the plane of the major surface of said first and third substrates whereby the major planes of said first, second and third substrates are all disposed in essentially parallel planes when said finger-like projections are received in their respective apertures.

9. A printed wiring board connector comprising:

(a) a first substrate including at least two finger-like projections extending outwardly from the periphery of said first substrate;

(b) a first layer of conductive material affixed to said portions of said first substrate and said finger-like projections;

(c) a second substrate including at least two tined finger-like projections extending outwardly from the periphery of said second substrate, the tines thereof being adapted for receiving and grasping the finger-like projection of said first substrate; and

(d) a second layer of conductive material affixed to selected portions of said second substrate and to at least one of said tined finger-like projections and being adapted for forming a connection between said first and second layers of conductive material when said tines of said tined finger-like projections grasp said finger-like projections of said first substrate.

10. A printed wiring board connector, comprising:

(a) a first substrate including at least two finger-like projections extending outwardly from the central portion of said substrate;

(b) a first layer of insulating material covering, at least in part, said first substrate including said finger-like projections;

(c) a first layer of conductive material affixed to selected areas of said first layer of insulating material and said finger-like projections;

(d) a second substrate having at least two finger-like projections extending outwardly from the central portion of said second substrate;

(e) a second layer of insulating material covering, at least in part, said second substrate including the finger-like projections eminating therefrom;

(f) a second layer of conductive material affixed to selected areas of said second layer of insulating material and said projections eminating from the central portion of said second substrate;

(g) a third substrate having apertures for receiving the finger-like projections;

from said first and second substrates;

(h) a third layer of insulating material covering, at least in part, said third substrate;

(i) a third layer of conductive material affixed to said third layer of insulating material covering at least part of the peripheral area of said apertures, for making electrical contact with said first and second layers of conductive material when said finger-like projections are inserted into said apertures; and

(j) wherein said finger-like projections eminating from the central portions of said first and third substrates are disposed in a plane essentially at a right angle to the plane of the major surface of said first and third substrates whereby the major planes of said first, second and third substrates are all disposed in essentially parallel planes when said finger-like projections are received in their respective apertures.