Thick film thermocouples

• US 4,110,124 A
• Filed: 09/22/1975
• Issued: 08/29/1978
• Est. Priority Date: 09/22/1975
• Status: Expired due to Term

• Current Assignee: Engelhard Corporation (BASF SE)
• Original Assignee: Engelhard Minerals & Chemicals Corporation
• Inventors: Robertson, Allen R., Hill, James S.
• Primary Examiner(s): Moskowitz, Nelson
• Application Number:
  US05/615,583
• Time in Patent Office: 1,072 Days
• Field of Search: 136/236 R, 136/241, 73/359, 252/514, 252/518.1, 75/208 R, 29/420.5, 29/573
• US Class Current: 136/236.1
• CPC Class Codes: H10N 10/01 Manufacture or treatment
• CPC Class Codes: H10N 10/854 comprising only metals H10N10/852, H10N10/853 take precedence

Abstract

A thick film thermocouple matching the performance of solid wire thermocouples and capable of operating at high temperatures with minimal drift is produced by (1) forming two powdered metal pastes of differing compositions, each including a frit which is substantially neutral with respect to the metal components of the respective paste and has essentially no effect upon the thermoelectric EMF, (2) applying the pastes to a surface to form a pair of thick film elements overlapping at one point which form a thermocouple upon firing, (3) firing the applied pastes, and (4) attaching leads to the fired elements and assembling the finished thermocouple. Optionally, the thermocouple elements or legs may be overglazed to protect them against damage to the metal films and to improve stability during continuous use at high temperatures.

Claims

1. A two-component system for use in forming by thick film techniques a thermocouple having joined positive and negative elements on a common electrically nonconductive surface, comprising:

a first paste and a second paste for application individually to said surface and firing thereon to form two films overlapping only at a thermoelectric junction area;

each of said pastes consisting essentially of (a) a powdered metal component consisting of at least one metal selected from the group consisting of platinum, palladium, iridium, rhodium, ruthenium, gold, and silver, (b) a frit in amount by weight equal to between about 5-35 percent of the combined weight of metal and frit, said frit containing constituents neutral with respect to said metal components and a total of less than one weight percent of constituents capable of causing a significant detrimental effect on the thermoelectric EMF produced at said junction whereby the thermoelectric EMF of said thermocouple is stablized and drift of said EMF during operation is minimized, and (c) an organic liquid vehicle;

the composition of said powdered metal components in said first and second pastes being sufficiently different to provide said thermoelectric EMF across said junction; and

said powdered metal component and said frit being admixed and suspended in said vehicle in each of said pastes.

2. The two-component system of claim 1, wherein said powdered metal component of said first paste consists essentially of about 50-85 percent palladium, about 10-35 percent platinum, and about 2-15 percent gold by weight for forming a positive thermocouple element, and said powdered metal component of said second paste consists essentially of about 60-70 percent gold and about 30-40 percent palladium by weight for forming a negative thermocouple element.

3. The two-component system of claim 2, wherein said powdered metal component of said first paste consists essentially of a powdered alloy containing about 83 percent palladium, about 14 percent platinum, and about 3 percent gold by weight for forming a positive thermocouple element, and said powdered metal component of said second paste consists essentially of a powdered alloy containing about 65 percent gold and about 35 percent palladium by weight for forming a negative thermocouple element.

4. The two-component system of claim 2, wherein said powdered metal component of said first paste consists essentially of a powdered alloy containing about 55 percent palladium, about 31 percent platinum, and about 14 percent gold by weight for forming a positive thermocouple element, and said powdered metal component of said second paste consists essentially of a powdered alloy containing about 65 percent gold and about 35 percent palladium by weight for forming a negative thermocouple element.

5. The two-component system of claim 1 wherein said frit contains only such amounts of lead oxides as cause no significant detrimental effect upon the thermoelectric EMF drift of the formed thermocouple.

6. The two-component system of claim 1 wherein said frit contains a total of less than about one weight percent of the group of metal oxides consisting of lead, copper, cadmium, bismuth, nickel, cobalt, and iron.

7. A thermocouple, comprising:

a support member providing an electrically nonconductive surface;

a positive element deposited and fired on said surface, consisting essentially of a first powdered metal component consisting of at least one metal selected from the precious metal group consisting of platinum, palladium, iridium, rhodium, ruthenium, gold, and silver, and between about 5-35 weight percent of a frit adherent to said surface and containing constituents neutral with respect to said first metal component and a total of less than one weight percent of constituents capable of causing a significant detrimental effect on the thermoelectric EMF produced at the junction area of said thermocouple whereby the thermoelectric EMF of said thermocouple is stabilized and drift is minimized during operation; and

a negative element deposited and fired on said surface and contacting said positive element only at a junction area, consisting essentially of a second powdered metal component consisting of at least one metal selected from said precious metal group but sufficiently different in composition from said first powdered metal component so as to provide said thermoelectric EMF across said junction, and between about 5-35 weight percent of a frit containing constituents neutral with respect to said second metal component and a total of less than one weight percent of constituents capable of causing a significant detrimental effect on the thermoelectric EMF produced at the junction area of said thermocouple whereby said thermoelectric EMF of said thermocouple is stabilized and drift is minimized during operation.

8. The thermocouple of claim 7, in which said first powdered metal component consists essentially of about 50-85 percent palladium, about 10-35 percent platinum, and about 2-15 percent gold by weight, and said second powdered metal component consists essentially of about 60-70 percent gold and about 30-40 percent palladium by weight.

9. The thermocouple of claim 8, in which the fired frit of each of said elements is present in amount by weight equal to between about 5-35 percent of the combined weight of the metal and frit in that element.

10. The thermocouple of claim 9, in which the frit is present in each of said elements in amount between about 10-20 percent of the combined weight of the metal and frit therein.

11. The thermocouple of claim 7, in which said positive and negative elements are covered by a fired adherent overglaze.

12. The thermocouple of claim 8, in which said first powdered metal component is an alloy of about 83 percent palladium, about 14 percent platinum, and about 3 percent gold by weight, and said second powdered metal component is an alloy of about 65 percent gold and about 35 percent palladium by weight.

13. The thermocouple of claim 8, in which said first powdered metal component is an alloy of about 55 percent palladium, about 31 percent platinum, and about 14 percent gold by weight, and said second powdered metal component is an alloy of about 65 percent gold and about 35 percent palladium by weight.

14. A method of making a thermocouple, comprising the steps of:

(1) providing a first paste and a second paste adapted for application to and firing on a surface to form thermocouple elements thereon, each of said pastes consisting essentially of (a) a powdered metal component consisting of at least one metal selected from the group consisting of platinum, palladium, iridium, rhodium, ruthenium, gold, and silver, (b) a frit in amount by weight equal to between about 5-35 percent of the combined weight of metal and frit, said frit containing constituents being neutral with respect to said metal components and a total of less than one weight percent of constituents capable of causing a significant detrimental effect on the thermoelectric EMF produced at said junction, whereby the thermoelectric EMF of said thermocouple is stabilized and drift of said EMF during operation is minimized and (c) an organic liquid vehicle;

the composition of said powdered metal components in said first and second pastes being sufficiently different to provide said thermoelectric EMF across such junction, and said powdered metal component and said frit being admixed and suspended in said vehicle in each of said pastes;

(2) applying said first paste as a first film on an electrically nonconductive surface;

(3) applying said second paste as a second film on said surface with said second film overlying said first film only at a junction area; and

(4) firing said first and second films on said surface to eliminate said vehicles and form adherent, electrically conductive positive and negative thermocouple elements from said first and second films respectively.

15. The method of claim 14, wherein said first paste is provided with a powdered metal component consisting essentially of about 50-85 percent palladium, about 10-35 percent platinum, and about 2-15 percent gold by weight, and said second paste is provided with a powdered metal component consisting essentially of about 60-70 percent gold and about 30-40 percent palladium by weight.

16. The method of claim 15, wherein said first paste is provided with a powdered metal component consisting essentially of about 83 percent palladium, about 14 percent platinum, and about 3 percent gold by weight, and said second paste is provided with a powdered metal component consisting essentially of about 65 percent gold and about 35 percent palladium by weight.

17. The method of claim 15, wherein said first paste is provided with a powdered metal component consisting essentially of about 55 percent palladium, about 31 percent platinum, and about 14 percent gold by weight, and said second paste is provided with a powdered metal component consisting essentially of about 65 percent gold and about 35 percent palladium by weight.

18. The method of claim 14, wherein said firing step (4) is carried out by drying the films applied to the surface in step (4) at a temperature of about 100°

-150°

C for at least 10 minutes, increasing the temperature to about 1000°

C during a period of about 45 minutes, then holding at about 1000°

C for a period of about 15 minutes.

19. The method of claim 14, wherein, following said firing step (4), a glazing formulation is applied to the fired films, followed by firing to form thereon an adherent overglaze.

20. The method of claim 19, wherein said glazing formulation consists essentially of a frit and an organic liquid vehicle, and said frit in both of said pastes and in said glazing formulation having substantially the same composition.