Method of mounting integrated circuit chips on a substrate and apparatus for carrying out the method

• US 4,116,376 A
• Filed: 05/31/1977
• Issued: 09/26/1978
• Est. Priority Date: 09/20/1976
• Status: Expired due to Term

• Current Assignee: Compagnie Internationale Pour L'Informatique Cii-Honeywell Bull
• Original Assignee: Compagnie Internationale Pour L'Informatique Cii-Honeywell Bull
• Inventors: Grosjean, Henri, Delorme, Raymond Louis
• Primary Examiner(s): Smith, Al Lawrence
• Assistant Examiner(s): Ramsey, K. J.
• Application Number:
  US05/801,787
• Time in Patent Office: 483 Days
• Field of Search: 228/6 A, 228/13, 228/56.5, 228/180 A, 228/170, 228/105
• US Class Current: 228/170
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 24/80 Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01044 Ruthenium [Ru]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01073 Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/01088 Radium [Ra]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H05K 13/0465 by soldering H05K13/0469 takes precedence
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53183 : Multilead component

Abstract

Method and apparatus to enable integrated circuit chips to be accurately mounted on substrates. Each chip is precisely positioned with respect to connecting areas on the substrates to which it is soldered. To this end, a support block is movable horizontally along a predetermined path and adapted to receive a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center. A cutting tool having on the one hand a cutting head movable along a working axis perpendicular to the path followed by the support block is arranged to pass through a first fixed point on the said path, and on the other hand a cutting die arranged in the path of the head is arranged to receive an integrated circuit chip mounted on a support. A soldering tool is provided consisting of a soldering head movable along a working axis parallel to the working axis of the cutting tool and which passes through a second fixed point on the path followed by the support block, along with a positioning assembly whose positioning axis is parallel to the working axes and passes through a third fixed point on the path followed by the support block.

The substrate is shifted with respect to the support block to cause the center of a set of connecting areas to coincide with the said positioning axis, and the support block is locked in position under the cutting tool and then under the soldering tool in such a way that a reference on the said support block successively occupies, with respect to the respective working axis of the two tools, the same positions as occupied with respect to the positioning axis. Finally, actuating means are included to control the movements of the cutting and soldering heads.

Claims

1. A method of mounting on a substrate which is provided with at least one set of connecting areas arranged in a predetermined configuration about a center, at least one integrated circuit chip which has previously been mounted on a flexible support of inextensible insulating material, the said chip being provided with connecting conductors which are attached to the said flexible support and extend from the edges of the chip, comprising the steps of:

positioning the support containing the chip on a support carrier,

placing the support carrier in a cutting tool having a cutting head movable along a working axis and a cutting die arranged in the path of the said head, in such a way that the center of the chip is placed over the die and is aligned with said working axis,

placing the substrate on a support block movable in a direction perpendicular to the said working axis, initially positioning the support block such that a reference on said support block is aligned in predetermined positions with respect to a fixed positioning axis parallel to the said working axis,

shifting the substrate with respect to the support block to cause the center of a set of connecting areas on the substrate to coincide with the said fixed positioning axis,

moving the support block to bring the substrate under the cutting tool such that the reference means occupies the same position with respect to the working axis of the said tool as occupied with respect to the positioning axis,

actuating the cutting tool to cause the cutting head, in the course of its movement, to cut through the connecting conductors of the chip which has been positioned on the cutting die, carrying the chip thus separated from its support along by the head and positioning said separated chip against the substrate,

raising the head clear of the die and after the head has been so raised, moving the support block to bring the substrate under a soldering head movable along a working axis parallel to the positioning axis, in such a way that the reference means occupy the same position with respect to the working axis of the soldering head as occupied with respect to the positioning axis,

actuating the soldering head to press against the connecting areas on the substrate the portions of the connecting conductors, remaining on the chip which has been positioned against the substrate, supplying power to the head to cause the said portions to be soldered to the said areas, and returning the soldering head to its initial position.

2. A method as set forth in claim 1 wherein said step of positioning said separated chip against the substrate includes adhering said chip against the substrate.

3. A method as set forth in claim 1 wherein the support block is locked in place when positioned under the cutting tool and under the soldering head.

4. Apparatus for mounting, on a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center, at least one integrated circuit chip which has been previously mounted on a flexible support of inextensible insulating material, the said chip being provided with connecting conductors which are attached to the said flexible support and extend from the edges of the chip, comprising, in combination:

a support block movable horizontally along a predetermined path, said support block being provided with reference means and beng adapted to receive thereon a substrate provided with at least one set of connecting areas which are arranged in a predetermined configuration about a center,

a cutting tool consisting on the one hand of a cutting head moveable along a working axis perpendicular to the path followed by the support block and which passes thorugh a first fixed point on the said path, and on the other hand of a cutting die arranged in the path of the said head, said cutting die being adapted to receive an integrated circuit chip mounted on the flexible support,

a soldering tool including a soldering head movble along a working axis parallel to the working axis of the cutting tool and which passes through a second fixed point on the path followed by the support block,

a positioning assembly having a positioning axis parallel to the said working axes and which passes through a third fixed point on the path followed by the suport block,

means for shifting the substrate with respect to the support block to cause the center of a set of connecting areas on the substrate to coincide with the said positioning axis,

locking means to position the support block under the cutting tool and then under the soldering tool in such a way that the reference means of the said support block successively occupy, with respect to the respective working axis of the two tools, the same positions as they occupied with respect to the positioning axis, the

actuating means to control the movements of the cutting and soldering heads.

5. Apparatus according to claim 4 wherein the support block is mounted for movement in a straight line, the reference means being formed by an index mark which is attached to the said support block and, when the support block is moved, can be brought opposite any one of three fixed reference marks, the first of these reference marks being associated with the positioning axis, the second being associated with the working axis of the soldering tool, and the third being associated with the working axis of the cutting tool, the distance separating the second reference mark from the first being equal to the distance between the working axis of the soldering tool and the positioning axis and the distance separating the third reference mark from the first being equal to the distance between the working axis of the cutting tool and the positioning axis.

6. Apparatus as set forth in claim 5 wherein the flexible support includes two perforations arranged on either side of each opening along the central transverse axis thereof and at right angles thereto, and further including a detachable support carrier means for receiving the flexible support and accurately positining the flexible support in the cutting tool.

7. Apparatus as set forth in claim 6 wherein the support carrier means includes on the one hand two locating pads at one end adapted to bear against two corresponding seats in the cutting tool, and on the other hand two spigots at the other end adapted to provide an interference fit with the two perforations associated with any one of the said openings, said two spigots being so positioned that, when the support carrier is engaged in the cutting tool and the spigots are engaged in locating bores in the said tool, the chip which is attached in the said opening is centered on the working axis of the cutting tool.

8. Apparatus as set forth in claim 5 wherein the means for shifting the substrate consists of a plate mounted on the support block, said plate being movable in a plane perpendicular to the said positioning axis so as to enable the center of a set of connecting areas on the substrate to be made coincident with the said positioning axis.

9. Apparatus as set forth in claim 5 wherein the positioning assembly comprises a television camera having a reticle and associated display screen.

10. Apparatus as set forth in claim 5 which further includes a substrate-carrying block on which the substrate is placed and held immobile, a movable plate, the substrate-carrying block being attached to the movable plate and said plate being carried by said support block and shiftable with respect thereto in two mutually perpendicular directions.

11. Apparatus according to claim 4 wherein the locking means comprises a rod extending parallel to the direction of movement of the support block, said rod having three elements each in the shape of a centrally grooved pulley, a lever, and a ball bearing mounted on said lever, said lever being pivoted on a shaft secured to the support block.

12. Apparatus as set forth in claim 11, wherein said locking means includes a spring for urging the ball bearing towards the said rod, said spring being tensioned between the lever and a point of attachment on the support block.

13. Apparatus as set forth in claim 11 wherein said three elements are associated with respective ones of the fixed reference marks and so positioned that, when the index mark is situated opposite any one of the reference marks, the said ball-bearing is engaged in the groove of the element associated with this reference mark.

14. Apparatus as set forth in claim 13 wherein the flexible support includes two peforations arranged on either side of each opening along the central transverse axis thereof and at right angles thereto, and further including a detachable support carrier means for receiving the flexible support and accurately positioning the flexible support in the cutting tool.

15. Apparatus as set forth in claim 14 wherein the support carrier means includes on the one hand two locating pads at one end adapted to bear against two corresponding seats in the cutting tool, and on the other hand two spigots at the other end adapted to provide an interference fit with the two perforations associated with any one of the said openings, said two spigots being so positioned that, when the support carrier is engaged in the cutting tool and the spigots are engaged in locating bores in the said tool, the chip which is attached in the said opening is centered on the working axis of the cutting tool.

16. Apparatus as set forth in claim 13 wherein the means for shifting the substrate consist of a plate mounted on the support block, said plate being movable in a plane perpendicular to the said positioning axis so as to enable the center of a set of connecting areas on the substrate to be made coincident with the said positioning axis.

17. Apparatus as set forth in claim 16 wherein the positioning assembly comprises a television camera having a reticle and associated with a display screen.

18. Apparatus as set forth in claim 17 which further includes a substrate-carrying block on which the substrate is placed and held immobile, the substrate-carrying block in turn being attached to the movable plate.