Crossovers and method of fabrication
First Claim
1. In a microelectronic circuit comprising a pair of conductive elements and a conductor therebetween on an insulating substrate, a structure which provides an electrical connection between said pair of conductive elements comprising an insulating layer formed over the conductor between said pair, said insulating layer comprising 50-90% by weight SiO2 with a particle size of 3 μ
- m or less and including 0.5-5% by weight of fumed silica and 10-40% by weight of an organic dielectric, and a crossover conductor formed on said insulating layer making electrical contact between said pair of conductive elements.
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Accused Products
Abstract
Disclosed is a crossover structure and method of fabricating such crossovers in microelectronic circuits. The invention utilizes as a separator between the crossover beam and the conductor on the substrate a mixture of at least 50 percent by weight of fine grain SiO2 and an organic dielectric. For high temperature curing, this dielectric can be a silicone resin. For metallization systems which are sensitive to high temperatures, the dielectric can be a low temperature or ultra-violet curing organic material, such as an epoxy. The crossover processing is simplified by fabricating the beam crossover in direct contact with the insulating layer.
35 Citations
12 Claims
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1. In a microelectronic circuit comprising a pair of conductive elements and a conductor therebetween on an insulating substrate, a structure which provides an electrical connection between said pair of conductive elements comprising an insulating layer formed over the conductor between said pair, said insulating layer comprising 50-90% by weight SiO2 with a particle size of 3 μ
- m or less and including 0.5-5% by weight of fumed silica and 10-40% by weight of an organic dielectric, and a crossover conductor formed on said insulating layer making electrical contact between said pair of conductive elements.
- View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of forming electrical connectors between a pair of conductive elements and across a conductor therebetween formed on an insulating substrate, comprising the steps of:
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screen printing an insulating layer across the conductor to be crossed where said insulating layer comprises 50-90% by weight SiO2 with a particle size of 3 μ
m or less and including 0.5-5% by weight of fumed silica and 10-40% by weight of an organic dielectric;curing said insulating layer; and depositing a crossover conductor over said insulating layer and contacting said pair of conductive elements. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification