Microstrip-fed parasitic array

• US 4,118,706 A
• Filed: 09/29/1977
• Issued: 10/03/1978
• Est. Priority Date: 09/29/1977
• Status: Expired due to Term

• Current Assignee: United States Of America As Represented By The Secretary Of The Army (Government of the United States of America)
• Original Assignee: The United States Of America As Represented By The Secretary Of The Army
• Inventors: Kerr, John L.
• Primary Examiner(s): Smith, Alfred E.
• Assistant Examiner(s): Barlow, Harry E.
• Application Number:
  US05/838,045
• Time in Patent Office: 369 Days
• Field of Search: 343/700 MS, 343/725, 343/830, 343/833, 343/846
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 19/30 the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

A multi-director parasitic array attached at the center of a microstrip anna design to provide a simple, low cost, efficient feed.

Claims

1. In an antenna, the combination comprising:

a circuit board of dielectric material having a metallic ground plane on one side thereof;

a radiating element in the form of a patch of metal etched on the opposite side of said board, said patch being continuous thereacross except for the removal of a portion in the central region thereof;

a multi-director parasitic array affixed to said circuit board at said central region;

and means for supplying an input signal to said radiating element for energizing said parasitic array.

2. The combination of claim 1 wherein said multi-director parasitic array includes a support boom, and wherein said support boom is affixed to said circuit board at said central region of said patch.

3. The combination of claim 2 wherein said circuit board and metallic ground plane are also continuous, except for the removal of a portion thereof substantially co-extensive with the removal of said patch portion etched thereupon, and wherein said support boom is affixed to said circuit board via passing through the discontinuous regions of said circuit board and ground plane thus formed, to be secured to said circuit board at the metallic ground plane side of said board.

4. The combination of claim 3 wherein the patch portion, circuit board portion and ground plane portion removed are of a cross-section substantially identical to that of said support boom where passing through said discontinuous regions of said circuit board and ground plane thus formed.