Method for forming a guarded Schottky barrier diode by ion-implantation

• US 4,119,446 A
• Filed: 08/11/1977
• Issued: 10/10/1978
• Est. Priority Date: 08/11/1977
• Status: Expired due to Term

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Mastroianni, Sal Thomas
• Primary Examiner(s): Rutledge, L. Dewayne
• Assistant Examiner(s): Roy, Upendra
• Application Number:
  US05/823,797
• Time in Patent Office: 425 Days
• Field of Search: 357/15, 357/52, 357/91, 148/1.5
• US Class Current: 438/526
• CPC Class Codes: H01L 21/2652 Through-implantation
• CPC Class Codes: H01L 21/266 using masks H01L21/26586 takes precedence
• CPC Class Codes: H01L 29/872 Schottky diodes

Abstract

An improved method for forming a guard ring Schottky barrier diode using ion implantation. Diodes formed in accordance with this method require less area but exhibit breakdown voltage comparable to known prior art guarded Schottky barrier diodes. The method is especially applicable to the fabrication of monolithic integrated circuits.

Claims

1. A method for forming on a semiconductor substrate portion of first conductivity type a metal-semiconductor diode surrounded directly by a doped-guard ring of second conductivity-type and further surrounded directly by an insulating layer on said substrate, comprising ion-implanting said substrate through said insulating layer using said metal as a mask.

2. The method of claim 1 further including providing an implant mask surrounding and spaced from said metal.

3. The method of claim 1 where an aperture in said insulator delineates said metal-semiconductor diode.

4. The method of claim 2 where said spacing is uniform about the periphery of the diode.

5. The method of claim 2 where an aperture in said insulator delineates said metal-semiconductor diode.

6. A method for forming a guarded Schottky barrier diode on a semiconductor substrate covered by an insulator comprising:

forming a first aperture in said insulating layer;

forming a metal semiconductor diode coextensive with said aperture;

forming a masking layer over said insulator;

providing a second aperture in said masking layer, said second aperture being an oversize replica of said first aperture; and

doping said substrate through second aperture and said insulating layer to provide a junction guard ring surrounding said metal-semiconductor diode.

7. The method of claim 6 where said junction guard ring is in precise alignment with said metal-semiconductor diode.