Application of field-assisted bonding to the mass production of silicon type pressure transducers

• US 4,121,334 A
• Filed: 01/14/1977
• Issued: 10/24/1978
• Est. Priority Date: 12/17/1974
• Status: Expired due to Term

• Current Assignee: Duracell Incorporated (Berkshire Hathaway Incorporated)
• Original Assignee: P R Mallory & Company Incorporated (Tupperware Brands Corporation)
• Inventors: Wallis, George
• Primary Examiner(s): McGlynn, Joseph H.
• Assistant Examiner(s): Desmond, E. F.
• Application Number:
  US05/759,521
• Time in Patent Office: 648 Days
• Field of Search: 29/574, 29/580, 29/589, 29/583, 29/610 SG, 29/590, 29/591, 338/2, 338/4
• US Class Current: 438/51
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 24/26 Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10T 29/49103 Strain gauge making

Abstract

A method for mass producing silicon type pressure transducers and transducers resultant therefrom are disclosed. In the method, the major components of a plurality of transducers are simultaneously joined together by a field-assisted bonding technique which allows the components to be made of materials having an approximate match in coefficients of thermal expansion and therefore imparts improved performance characteristics to the individual transducers during operation. This method of mass production of transducers reduces the amount of operational steps and significantly reduces the amount of time and labor required for manufacture.

Claims

1. In a method of making a structure containing a plurality of pressure transducers and adapted to be separated into individual pressure transducers, the steps comprising providing a diaphragm comprising a slice of semiconductor containing material having first and second surfaces with a plurality of diffused circuits on said first surface of the slice and a slice of glass containing material having a plurality of cavities formed on one surface and having a substantially equal coefficient of thermal expansion with the semiconductor containing material, and joining the slice of semiconductor containing material at said second surface by field assisted bonding to the slice of glass containing material so as to close the cavities in the slice of glass containing material.

2. In the method of claim 1 wherein the slice of semiconductor containing material is silicon containing material.

3. In the method of claim 1 wherein after joining the slices into a structure, separating the structure into a plurality of physically disunited transducers.