Method and means for locating process points on miniaturized circuits

• US 4,125,798 A
• Filed: 04/11/1977
• Issued: 11/14/1978
• Est. Priority Date: 04/11/1977
• Status: Expired due to Term

• Current Assignee: Charles Fredrick Miller Trust
• Original Assignee: Miller C. Fredrick
• Inventors: Miller, C. Fredrick
• Primary Examiner(s): Dobeck, B.
• Application Number:
  US05/786,253
• Time in Patent Office: 582 Days
• Field of Search: 318/685, 318/574, 318/575, 318/603, 364/474, 364/475, 364/476
• US Class Current: 318/574
• CPC Class Codes: G05B 19/40 Open loop systems, e.g. using stepping motor
• CPC Class Codes: G05B 2219/34239 Multiplex for whole system

Abstract

A method and an apparatus is provided by which automatic or semi-automatic processing of integrated and printed circuit devices can be accomplished notwithstanding that the points at which processing must be accomplished have been displaced from their assigned positions by translation and rotation. The method involves measurement of displacement of some circuit points from their designated positions in a specified sequence. That is coupled with a physical positioning and orientation of the device relative to the process apparatus and with approximate calculation. An apparatus is disclosed by which the measurements, sequence of measurements, orientation, and computation required can be accomplished.

Claims

1. The method of locating rotationally displaced process points that have preassigned X and Y coordinate positions in an X, Y plane on an electronic device with the aid of a position identifier in the circumstance in which the identifier and the device are capable of relative motion parallel to said X, Y plane, which method includes the steps of:

positioning and orienting the device and the identifier such that the identifier is aligned with a home position on the device;

measuring the amount of relative movement required in the X and the Y directions to move the indentifier from a position over the preassigned X and Y coordinates of a selected bonding point to a position over the actual position of that bonding point;

converting the measurement so made into a representation of the sine or tangent of the angle of rotational displacement; and

finding the position of another process point by adding to its preassigned X coordinate an X distance proportional to the product of the preassigned Y coordinate of said other process point and said representation, and by adding to the preassigned Y coordinate of said other bonding point a distance proportional to the product of the preassigned X coordinate of said other process point and said representation.

2. The method defined in claim 1 in which the step of measuring is preceded by the step of measuring the displacement, in the X and Y directions, of a first bonding point from its assigned position;

and

in which the X and Y coordinates of the preassigned positions of said selected and said other bonding points are altered in X and Y by the amount of said displacement in X and Y, respectively.

3. In the process of moving a processing machine and a workpiece having a plurality of process points on its surface each of which has a preassigned X and Y coordinate position, which method comprises the steps of:

positioning and orienting the device relative to the bonding tool such that the tool overlies a home position on said device;

measuring the difference between the actual position of one of said process points and the position of the intersection of its preassigned X and Y coordinates in terms of X direction difference and Y direction difference;

adding the difference in the X direction and the difference in the Y direction so found to the preassigned X and Y coordinates of a second process point to find a corrected, reassigned X and Y corrdinates for that second process point; and

finding the difference between the actual position of said second process point and its reassigned X and Y coordinates.

4. The invention defined in claim 3 in which said second process point is selected to lie substantially in the X direction from said home position whereby the difference between the actual position and the reassigned coordinates of said second process point extends substantially in the Y direction.

5. The invention defined in claim 3 in which said second process point is selected to be substantially in the Y direction from said home position whereby the difference between the actual position and the reassigned coordinates of said second process point extends substantially in the X direction.

6. The invention defined in claim 3 in which said difference between the actual position and the reassigned X and Y coordinates of said second process position is found measuring the amount of relative rotation about said home position to place the actual position of said second process point at said reassigned coordinates.

7. The invention defined in claim 3 which comprises the further step of correcting the preassigned X and Y coordinates of every other process point on said device to find their reassigned positions by adding thereto said X direction difference and said Y direction difference, respectively;

and

by adding to each redefined position a further correction the amount of which is the product of a function of the angular displacement corresponding to the difference between the actual position of said second process point and of the Y and X coordinates of each of said other process points, respectively.

8. The invention defined in claim 7 in which said function is proportional to the ratio of X direction displacement at a second process point lying substantially on the Y axis through said home position and the Y coordinate of said second process point.

9. The invention defined in claim 7 in which said function is proportional to the degree of rotation about said home position required to accomplish the step of finding the difference between the actual position of said second process point and its reassigned X and Y coordinates.

10. The invention defined in claim 7 in which said function is proportional to the ratio of the Y direction displacement at a second process point lying substantially on the X axis through said home position and the X coordinate of said second process point.

11. For use with a wire bonding machine of the kind that includes a work point indicating means for indicating the work point at which the bonding tool will effect bonding on a workpiece and further includes means for producing relative movement in X and Y directions in the plane of said workpiece between the tool and workpiece automatically such that the tool is moved in predefined sequence to each of a number of process points on the workpiece the position of which process points is defined in terms of a home position on the workpiece:

means for moving the workpiece relative to said work point to bring the point designated home position under the indicating means and for orienting the workpiece with its X direction parallel to said X direction of relative movement;

means for moving the workpiece relative to said work point to place the assigned position of one of said process points under said work point;

measuring means for measuring the displacement of said one process point from said work point;

means for altering the preassigned position of a second one of said process points by the amount of said displacement; and

means for measuring the displacement of said second one of said process points from its reassigned position.

12. The invention defined in claim 11 which further comprises means for altering the preassigned position of others of said process points by the amount of displacement found between the position of the first process point and its preassigned position to find their respective reassigned positions;

and

means for adding to the reassigned position of each of said other process points a further correction which is a function of the degree of rotation about said home position of said second process point to place said second process point at its reassigned position.

13. The invention defined in claim 11 in which the means for measuring the displacement of the second process point from its reassigned position comprises means for rotating the workpiece about said home position.

14. The invention defined in claim 11 in which the means for measuring the displacement of the second process point from a reassigned position comprises means for measuring that displacement in terms of at least one of the X and Y directions.