Apparatus for selective electroplating of workpieces
First Claim
1. An apparatus for selective local electroplating of workpieces comprising:
- a plating solution feed system;
a plating unit having an enclosed cavity communicating with said plating solution feed system, a top wall of the plating unit having passages for plating solution to pass through towards said workpieces;
a masking means mounted on said top wall of said plating unit to mask workpiece surface areas not to be plated;
pressing means in the form of a magazine with at least two pressure surfaces, each pressure surface having sealing gaskets;
workpiece orientation members mounted on each one of said magazine pressure surfaces;
means for fixing workpieces in the oriented position mounted on each one of said magazine pressure surfaces;
a vertical movement actuator operatively connected to said pressing means in a manner which provides for rotation of said magazine about a horizontal axis extending substantially between said pressure surfaces, so that when one of said pressure surfaces presses workpieces against said top wall of said plating unit, the other pressure surface is in a position which permits another lot of workpieces to be placed thereon or removed therefrom;
an anode mounted in the path of the flow of plating solution being fed towards said workpieces; and
a cathode connected to said workpieces in the process of plating.
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Accused Products
Abstract
The apparatus comprises a plating unit, the cavity of which communicates with a plating solution feed system, and pressing means mounted above the plating unit. The pressing means according to the invention is made in the form of a magazine with two or more pressure surfaces whereon sealing members, workpiece orientation members and workpiece retaining members are mounted. The magazine is operatively connected to a vertical movement actuator in a manner which provides for rotation of the magazine about its horizontal axis. A masking member is mounted on the surface of the plating unit to mask the workpiece surface areas not to be plated. The apparatus comprises an anode which is mounted in the internal space or cavity of the plating unit in the path of the plating solution flowing towards the workpiece, and a cathode connected to the workpiece.
The apparatus ensures a higher efficiency of the plating process, due to the fact that simultaneously with the plating of workpieces pressed between the plating unit surface and one of the pressure surfaces of the magazine it is possible to remove plated workpieces from and place the next lot of workpieces to be plated onto the other pressure surface.
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Citations
7 Claims
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1. An apparatus for selective local electroplating of workpieces comprising:
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a plating solution feed system; a plating unit having an enclosed cavity communicating with said plating solution feed system, a top wall of the plating unit having passages for plating solution to pass through towards said workpieces; a masking means mounted on said top wall of said plating unit to mask workpiece surface areas not to be plated; pressing means in the form of a magazine with at least two pressure surfaces, each pressure surface having sealing gaskets; workpiece orientation members mounted on each one of said magazine pressure surfaces; means for fixing workpieces in the oriented position mounted on each one of said magazine pressure surfaces; a vertical movement actuator operatively connected to said pressing means in a manner which provides for rotation of said magazine about a horizontal axis extending substantially between said pressure surfaces, so that when one of said pressure surfaces presses workpieces against said top wall of said plating unit, the other pressure surface is in a position which permits another lot of workpieces to be placed thereon or removed therefrom; an anode mounted in the path of the flow of plating solution being fed towards said workpieces; and a cathode connected to said workpieces in the process of plating.
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2. An apparatus for selective local electroplating of workpieces comprising:
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a plating solution feed system; a plating unit having an enclosed cavity communicating with said plating solution feed system, a top wall of the plating unit having passages for plating solution to pass through towards said workpieces; a masking means mounted on said top wall of said plating unit to mask workpiece surface areas not be be plated; pressing means in the form of a magazine with at least two pressure surfaces, each pressure surface having sealing gaskets, said magazine is a cross piece with journals at its ends, the common axis of these journals being an axis of rotation of said magazine; workpiece orientation members mounted on each one of said magazine pressure surfaces; means for fixing workpieces in the oriented position mounted on each one of said magazine pressure surfaces; a vertical movement actuator operatively connected to said pressing means in a manner which provides for rotation of said magazine about said horizontal axis, so that when one of said pressure surfaces presses workpieces against said top wall of said plating unit, the other pressure surface is in a position which permits another lot of workpieces to be placed thereon or removed therefrom, said vertical movement actuator comprising movable rods in which said magazine journals are rotatably mounted; an anode mounted in the path of the flow of plating solution being fed towards workpieces; and a cathode connected to said workpieces in the process of plating. - View Dependent Claims (3, 4, 5, 6, 7)
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Specification