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Apparatus for selective electroplating of workpieces

  • US 4,126,533 A
  • Filed: 07/22/1977
  • Issued: 11/21/1978
  • Est. Priority Date: 07/28/1976
  • Status: Expired due to Term
First Claim
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1. An apparatus for selective local electroplating of workpieces comprising:

  • a plating solution feed system;

    a plating unit having an enclosed cavity communicating with said plating solution feed system, a top wall of the plating unit having passages for plating solution to pass through towards said workpieces;

    a masking means mounted on said top wall of said plating unit to mask workpiece surface areas not to be plated;

    pressing means in the form of a magazine with at least two pressure surfaces, each pressure surface having sealing gaskets;

    workpiece orientation members mounted on each one of said magazine pressure surfaces;

    means for fixing workpieces in the oriented position mounted on each one of said magazine pressure surfaces;

    a vertical movement actuator operatively connected to said pressing means in a manner which provides for rotation of said magazine about a horizontal axis extending substantially between said pressure surfaces, so that when one of said pressure surfaces presses workpieces against said top wall of said plating unit, the other pressure surface is in a position which permits another lot of workpieces to be placed thereon or removed therefrom;

    an anode mounted in the path of the flow of plating solution being fed towards said workpieces; and

    a cathode connected to said workpieces in the process of plating.

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