Synthetic resin packed coil assembly

• US 4,137,515 A
• Filed: 11/14/1977
• Issued: 01/30/1979
• Est. Priority Date: 09/19/1974
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Yamashita, Kazuo, Akao, Masatake, Yokose, Yoshikazu, Shibano, Takashi
• Primary Examiner(s): Kozma, Thomas J.
• Application Number:
  US05/851,588
• Time in Patent Office: 442 Days
• Field of Search: 336/205, 336/206, 336/209, 336/84 R, 336/84 C, 336/96, 310/208
• US Class Current: 336/84.00C
• CPC Class Codes: H01F 5/06 Insulation of windings

Abstract

A synthetic resin packed coil assembly formed by a wound spiral of a number of bundled turns of insulated wire comprises at least one layer enveloping the bundled turns of insulated wire of the wound spiral. This layer is composed of a synthetic resin reinforced by a high strength fibrous material and is formed by first winding the high strength fibrous material around the bundled turns of insulated wire of the wound spiral, subsequently impregnating a solution of the synthetic resin and finally allowing the synthetic resin to harden.

Claims

1. A synthetic resin packed coil assembly which comprises

a wound spiral of a plurality of bundled turns of insulated wire,

a first layer of high strength fibrous material impregnated with a synthetic resin, said first layer forming the outer periphery of said synthetic resin packed coil assembly,

an intermediate insulating layer disposed between said wound spiral and said first layer, and

a semi-conductive layer disposed between said intermediate insulating layer and said first layer, said semi-conductive layer being constituted by a first ply firmly bonded to said intermediate insulating layer and a second ply firmly bonded to said first layer, there being a layer of a release agent and an air-gap layer disposed between said first and second plies.

2. A synthetic resin packed coil assembly as claimed in claim 1, wherein said intermediate insulating layer is a mixture of a synthetic resin and a member selected from the group consisting of silica, alumina, hydrated alumina, calcium carbonate, magnesia, talc, clay, titanium oxide, mica and glass.

3. A synthetic resin packed coil assembly as claimed in claim 1, wherein said semi-conductive layer is selected from the group consisting of carbon, a sheet containing carbon, a metallic compound, and a metal, or a synthetic resin containing a member selected from the group consisting of carbon, a metallic compound and a metal.

4. A synthetic resin packed coil assembly as claimed in claim 1, wherein said intermediate insulating layer has a thermal expansion coefficient of not more than 4 ×

10^-5 cm/cm/°

C at ambient temperature.

5. A synthetic resin packed coil assembly as claimed in claim 1, wherein said intermediate insulating layer is a resinous layer containing an inorganic material.

6. A synthetic resin packed coil assembly as claimed in claim 1, wherein said intermediate insulating layer is one formed by applying powdery resinous material onto the surface of said wound spiral.

7. A synthetic resin packed coil assembly as claimed in claim 1, wherein said intermediate insulating layer is one prepared from a synthetic resinous material having a bending strength of not less than 8 kg/mm.sup. 2.

8. A synthetic resin packed coil assembly as claimed in claim 1, wherein said intermediate insulating layer is one prepared from a synthetic resinous material having an elongation of not less than 5%.

9. A synthetic resin packed coil assembly as claimed in claim 1, wherein said fibrous material is selected from the group consisting of glass, carbon, boron, silica and alumina.