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Gas encapsulated cooling module

  • US 4,138,692 A
  • Filed: 09/12/1977
  • Issued: 02/06/1979
  • Est. Priority Date: 09/12/1977
  • Status: Expired due to Term
First Claim
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1. A cooling module for integrated circuit chips, said cooling module comprising:

  • a multilayer ceramic substrate having a first essentially planar surface and a second essentially planar surface, said multilayer ceramic substrate including an electrical circuit pattern contained therein and on at least one of said planar surface;

    a plurality of integrated circuit chips supported on said first planar surface of said substrate and electrically connected to said electrical circuit pattern of said multilayer ceramic substrate, each of said semiconductor chips having an essentially exposed planar surface;

    a plurality of electrically conductive connector pins extending from said second planar surface of said substrate, said plurality of electrically conductive pins being electrically connected to said electrical circuit pattern of said substrate;

    module cap means hermetically sealed to said substrate to provide a volume encompassing said plurality of chips;

    a plurality of bellows like structures, each of said bellows like structures extending from the exposed planar surface of a discrete one of said chips to said module cap means; and

    a cooling medium contained within said hermetically sealed volume formed by said substrate and said module cap means.

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