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Apparatus and method for aligning wafers

  • US 4,141,456 A
  • Filed: 08/30/1976
  • Issued: 02/27/1979
  • Est. Priority Date: 08/30/1976
  • Status: Expired due to Term
First Claim
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1. An apparatus for aligning wafers comprising:

  • (a) an alignment station including means for contacting and selectively holding a wafer in a fixed position;

    (b) a transfer chuck including means for contacting and selectively holding said wafer in a fixed position, said transfer chuck being separate and distinct from said alignment station;

    (c) means associated with said alignment station for receiving said transfer chuck in a predetermined orientation;

    (d) a microscope located in a fixed position relative to said alignment station in order that an operator will view and then align a wafer positioned at said alignment station relative to reference lines in said microscope; and

    (e) a remote operation station including means for contacting and selectively holding said wafer in a fixed position as well as means for receiving said transfer chuck in a predetermined orientation.

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