Manufacturing process for package for electronic devices

• US 4,141,712 A
• Filed: 07/18/1977
• Issued: 02/27/1979
• Est. Priority Date: 07/18/1977
• Status: Expired due to Term

• Current Assignee: Diacon, Inc.
• Original Assignee: Diacon, Inc.
• Inventors: Rogers, Bryant C.
• Primary Examiner(s): Fisher, Richard V.
• Assistant Examiner(s): Miga, F. W.
• Application Number:
  US05/816,598
• Time in Patent Office: 589 Days
• Field of Search: 65/59 B, 65/36, 65/42, 29/418, 29/630 B
• US Class Current: 65/36
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49799 Providing transitory integral holding or handling portion

Abstract

Semiconductor packages are manufactured according to a method which eliminates or greatly reduces the occurrence of short circuited or otherwise badly positioned leads. The method utilizes a leadframe having a bonding tip support connecting the bonding tips of the leads. After the leadframe is affixed to a ceramic element, the connecting element is removed.

Claims

1. A method for manufacturing a framework for a package for an electronic component comprising the steps of:

attaching to a package support a leadframe having a plurality of leads extending inwardly from a frame, the inwardmost portion of each lead terminating in a bonding tip, at least some of said bonding tips being interconnected by a bonding tip support which prevents relative motion among the interconnected bonding tips during the attaching step; and

then removing said bonding tip support to yield said framework for said package.

2. A method as in claim 1 wherein:

said package support comprises a window-frame cap having an opening disposed about said bonding tip support; and

said bonding tip support is removed by punching through said opening.

3. A method for manufacturing a package for an electronic component comprising the method of manufacturing a framework as in claim 2, and further including the step of attaching said framework to a package base configured for mounting of said electronic component.

4. A method as in claim 1 wherein said package support comprises a package base configured for mounting of said electronic component.

5. A method as in claim 4 wherein:

said bonding tip support comprises at least one tab interconnecting at least some of said bonding tips; and

said bonding tip support is removed by snapping off said tabs to yield said framework for said package.

6. A method as in claim 2 wherein the attaching step comprises the steps of:

glazing a surface of said window-frame cap with a material having a temperature coefficient of expansion closely matching that of said window-frame cap;

bringing said leadframe into intimate contact with said surface of said window-frame cap; and

heating said leadframe and said window-frame cap to a temperature sufficient to melt said material.