Method of providing printed circuits

• US 4,144,118 A
• Filed: 03/13/1978
• Issued: 03/13/1979
• Est. Priority Date: 03/23/1977
• Status: Expired due to Term

• Current Assignee: Amp-Akzo Corporation
• Original Assignee: Kollmorgen Technologies Corporation
• Inventors: Stahl, Fritz
• Primary Examiner(s): Powell, William A.
• Application Number:
  US05/885,648
• Time in Patent Office: 365 Days
• Field of Search: 204/15, 204/23, 204/32 R, 204/38 R, 427/96-99, 428/901, 29/625-627, 174/68.5, 156/150, 156/659, 156/656, 156/666, 156/667, 156/904, 156/901, 156/902, 252/79.2
• US Class Current: 216/17
• CPC Class Codes: H05K 2201/0175 Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
• CPC Class Codes: H05K 2201/0761 Insulation resistance, e.g. of the surface of the PCB between the conductors
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 2203/1157 Using means for chemical reduction
• CPC Class Codes: H05K 3/062 consisting of metals or alloys or metallic inorganic compounds H05K3/065 takes precedence
• CPC Class Codes: Y10S 428/901 Printed circuit

Abstract

There is provided an improvement in the method of preparing printed circuit boards by chemically catalyzing the surface of an insulating material, electrolessly depositing a layer of copper thereon, masking selected areas of the copper layer not correspnding to the desired pattern of conductor lines, electrolytically depositing additional copper on the unmasked areas, removing the masking material and etching away the copper from the previously masked areas. The improvement comprises the steps of forming an etch-resistant protective layer of oxide on the surface of the electrolytically deposited copper layer before removing the masking material, then removing the masking material and etching away the electrolessly deposited copper from the previously masked areas.

Claims

1. In a method of preparing a printed circuit board comprising the steps of chemically catalyzing the surface of an insulating material for the electroless deposition of metal, electrolessly deposited a layer of copper on said catalyzed surface, providing a layer of masking material on selected areas of the electrolessly deposited copper layer to leave an area of exposed copper in a desired pattern of conductor lines, building up an additional layer of copper on said exposed areas by electrolytic deposition, removing the layer of masking material and etching away the layer of electrolessly deposited copper from the previously masked areas, the improvement which comprises:

(a) before removing said masking material, forming an etch-resistant protective layer of oxide on the surface of the exposed layer of electrolytically deposited copper;

(b) removing said masking material from the layer of electrolessly deposited copper; and

(c) etching away the electrolessly deposited copper from the previously masked areas, to provide a printed circuit board having the desired surface pattern of conductor lines with an etch-resistant protective oxide layer thereon.

2. A process as defined in claim 1 wherein said etching treatment is prolonged to remove, in addition to the electrolessly deposited copper, any chemical residues from the catalyzing step from said previously masked areas.

3. A process as defined in claim 1 in which the insulating material includes one or more through-holes.

4. A process as defined in claim 1 wherein the layer of electrolessly deposited copper has a thickness of from 1 to 3 microns.

5. A process as defined in claim 1 which comprises the further step of applying a layer of an adhesion-promoting material to the surface of said insulating material before the catalyzing step.

6. A process as defined in claim 5 wherein the insulating material includes through-holes.

7. A process as defined in claim 6 wherein said through-holes are formed before the application of said adhesion-promoting layer.

8. A process as defined in claim 6 wherein said through-holes are formed after the application of said adhesion-promoting layer.

9. A process as defined in claim 1 which comprises the additional step of removing said protective oxide layer from the surface of said electrolytically deposited copper.

10. A process as defined in claim 9 wherein said removal is accomplished by contacting said oxide layer with dilute sulfuric acid.

11. A method as defined in claim 1 wherein said protective oxide layer is formed by contacting said exposed layer of electrolytically deposited copper with an aqueous solution comprising sodium chlorite, trisodium phosphate and sodium hydroxide.

12. A method as defined in claim 11 wherein said solution comprising, per liter, 160 grams of sodium chlorite, 10 grams of trisodium phosphate and 10 grams of sodium hydroxide, the balance comprising water.