Thermosetting silicone resin molding composition

• US 4,144,222 A
• Filed: 07/28/1977
• Issued: 03/13/1979
• Est. Priority Date: 09/07/1976
• Status: Expired due to Term

• Current Assignee: Toray Silicone Co Ltd (Toray Industries Incorporated)
• Original Assignee: Toray Silicone Co Ltd (Toray Industries Incorporated)
• Inventors: Hanada, Tsuneo, Shinmi, Hideo
• Primary Examiner(s): Marquis, Melvyn I.
• Application Number:
  US05/820,024
• Time in Patent Office: 593 Days
• Field of Search: 260/46.5 R, 260/825, 260/46.5 G, 260/37 SB
• US Class Current: 524/588
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08G 77/16 to hydroxyl groups
• CPC Class Codes: C08G 77/70 Siloxanes defined by use of the MDTQ nomenclature
• CPC Class Codes: C08K 3/011 Crosslinking or vulcanising agents, e.g. accelerators
• CPC Class Codes: C08K 5/57 Organo-tin compounds
• CPC Class Codes: C08L 2666/52 Metal-containing compounds
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes

Abstract

An improved thermosetting silicone resin molding composition characterized by consisting essentially of 100 parts by weight of organopolysiloxane resin having organic radical: Si ratio of 1.0:1 to 1.7:1 and containing at least 0.2% by weight of silicon-bonded hydroxyl groups, organohydrogenpolysiloxane containing at least one silicon bonded hydrogen atom in each molecule thereof, said organohydrogenpolysiloxane being in such an amount that the number of the hydrogen atoms per hydroxyl group in said organopolysiloxane is between 0.001 and 0.30, 0.01 to 15 parts by weight of organotin oxide, and 50 to 700 parts by weight of an inorganic filler.

Claims

1. A thermosetting silicone resin molding composition consisting essentially of:

(a) 100 parts by weight of an organopolysiloxane resin having the R/Si ratio of 1.0 to 1.7, R being substituted or unsubstituted univalent hydrocarbon radicals bonded to silicon atoms, and containing at least 0.2% by weight of silicon-bonded hydroxyl groups;

(b) organohydrogenpolysiloxane containing at least one silicon-bonded hydrogen atom in each molecule thereof, said organohydrogenpolysiloxane being in such amount that the number of said silicon-bonded hydrogen atoms per silicon-bonded hydroxyl group in said organopolysiloxane of (a) is 0.001 to 0.30;

(c) 0.01 to 15 parts by weight of organotin oxide (wherein the organic radicals are substituted or unsubstituted univalent hydrocarbon radicals); and

(d) 50-700 parts by weight of at least one inorganic filler.

2. A thermosetting silicone resin molding composition as set forth in claim 1, wherein said hydrocarbon radicals bonded to silicon atoms in the organopolysiloxane resin of (a) are phenyl and methyl radicals.

3. A thermosetting silicone resin molding composition as set forth in claim 1, wherein the amount of said organohydrogenpolysiloxane of (b) is such that the number of the silicon-bonded hydrogen atoms is 0.01 to 0.10 per silicon-bonded hydroxyl group in the organopolysiloxane of (a).

4. A thermosetting silicone resin molding composition as set forth in claim 1, wherein the amount of said organotin oxide in (c) is 0.5 to 7 parts by weight.

5. A thermosetting silicone resin molding composition as set forth in claim 1, wherein said organotin oxide of (c) is mono-organotin oxide.

6. A thermosetting silicone resin molding composition as set forth in claim 5, wherein said monoorganotin oxide of (c) is monobutyltin oxide.

7. A thermosetting silicone resin molding composition as set forth in claim 4, wherein said organotin oxide of (c) is monoorganotin oxide.

8. A thermosetting silicone resin molding composition as set forth in claim 7, wherein said monoorganotin oxide of (c) is monobutyltin oxide.