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Heat sink for rotating electronic circuitry

  • US 4,144,932 A
  • Filed: 06/02/1977
  • Issued: 03/20/1979
  • Est. Priority Date: 06/02/1977
  • Status: Expired due to Term
First Claim
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1. In a heat dissipating structure the combination comprising:

  • a plate member adapted to be mounted for rotation about an axis that is substantially normal to the plate member;

    cooling fins on said plate member with the large surface areas thereof extending axially along and arcuately about said axis; and

    said plate member having at least one opening that is circumferentially aligned with said cooling fins.

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