Resistor network having horizontal geometry

• US 4,159,461 A
• Filed: 11/22/1977
• Issued: 06/26/1979
• Est. Priority Date: 11/22/1977
• Status: Expired due to Term

• Current Assignee: CTS Corporation
• Original Assignee: Stackpole Components Company
• Inventors: Sonney, Kermit E., Kougher, Timothy M., Kost, Frederick H.
• Primary Examiner(s): Albritton, C. L.
• Application Number:
  US05/854,049
• Time in Patent Office: 581 Days
• Field of Search: 338/195, 338/320, 29/620
• US Class Current: 338/195
• CPC Class Codes: H01C 17/242 by laser trimming by laser in general B23K26/351
• CPC Class Codes: H01C 7/003 Thick film resistors
• CPC Class Codes: Y10T 29/49099 Coating resistive material on a base

Abstract

A film resistor network horizontal geometry having extended trim ratio and improved trimming and operating characteristics and method of using the same. The film resistor network comprises an insulating substrate having at least one film resistor formed thereon and a pair of opposed film conductor electrodes disposed on opposite sides of the film resistor. The side edges of the film resistor engaged by the film conductor electrodes flare outwardly from the bottom edge of the film resistor, at least on one side, and terminate in a dome-shaped top region that preferably is elongated semi-cylindrical in configuration. The dome-shaped top region is not engaged by the film conductor electrodes and the film resistor is trimmed by removal of a notch from the film resistor starting from the bottom edge and extending upwardly along a line substantially centered beneath the apex of the dome. With a film resistor thus formed, the trim ratio (TR) will conform to the expression TR=(1+% ΔR/laser bite)ⁿ where % ΔR/laser bite is the change in resistance achieved with one pulse of the cutting laser used to trim the resistor and n is the number of laser bites.

Claims

1. A film resistor network geometry having improved trimming and operating characteristics comprising an insulating substrate having at least one film resistor formed thereon and a pair of opposed film conductor electrodes disposed on opposite sides of the film resistor, said film resistor comprising a tapered lower region adjoining a dome-shaped top region, the side edge intercepts of the film resistor engaged by said film conductor electrodes flaring outwardly from the bottom edge of said film resistor at least on one side thereof to form the tapered lower region, said film conductor electrodes terminating at the junction of the tapered lower region with the dome-shaped top region of said film resistor whereby the dome-shaped top region is not engaged by said film conductor electrodes, said film resistor being trimmed by cutting a notch in the film resistor from the bottom edge thereof.

2. A film resistor network geometry according to claim 1 wherein the notch cut in the film resistor for trimming purposes is in the form of a fine silt or kerf produced by laser beam cutting commencing at the bottom edge and extending upwardly toward the dome-shaped top region along a line substantially centered beneath the apex of the dome-shaped top.

3. A film resistor network geometry according to claim 1 wherein the dome-shaped top region of the film resistor has an elongated semi-elliptical configuration.

4. A film resistor network geometry according to claim 1 wherein the film resistor possesses a trim ratio (TR) characteristic in accordance with the expression:

space="preserve" listing-type="equation">TR=(1+% Δ

R/laser bite).sup.n

where % Δ

R/laser bite represents the change in resistance of the film resistor produced by each cutting laser beam pulse or bite and n is the number of laser bites, and wherein the % Δ

R per laser bite is substantially constant over an extended range of values of trim ratio (TR) for a film resistor network of given physical dimensions and having a given value of initial resistance.

5. A film resistor network geometry according to claim 2 wherein the dome-shaped top region of the film resistor has an elongated semi-elliptical configuration and the film resistor possesses a trim ratio (TR) characteristic in accordance with the expression:

space="preserve" listing-type="equation">TR=(1+% Δ

R/laser bite).sup.n

where % Δ

R/laser bite represents the change in resistance of the film resistor produced by each cutting laser beam pulse or bite and n is the number of laser bites, and wherein the % Δ

R per laser bite is substantially constant over an extended range of values of trim ratio (TR) for a film resistor network of given physical dimensions and having a given value of initial resistance.

6. A film resistor network geometry according to claim 1 wherein the outwardly flaring side edge intercepts of the film resistor lie within a region having an outer limit defined by the expression X_l =mw+b and an inner limit defined by the expression X_l =(1+K)^w -1+b where X_l is the coordinate of the side edge intercept along the length of the film resistor geometry (abscissa) and w is the coordinate along the width (ordinate), m is the slope of the essentially straight line outer limit and b and K are constants determined by the desired starting geometry of the film resistor network as dictated by space constraints on the substrate.

7. A film resistor network geometry according to claim 6 wherein the notch cut in the film resistor for trimming purposes is in the form of a fine slit or kerf produced by laser beam cutting commencing at the bottom edge and extending upwardly toward the dome-shaped top region along a line substantially centered beneath the apex of the dome-shaped top.

8. A film resistor network geometry according to claim 7 wherein the dome-shaped top region of the film resistor has an elongated semi-elliptical configuration.

9. A film resistor network geometry according to claim 8 wherein the film resistor possesses a trim ratio (TR) characteristic in accordance with the expression:

space="preserve" listing-type="equation">TR=(1+% Δ

R/laser bite).sup.n

where % Δ

R/laser bite represents the change in resistance of the film resistor produced by each cutting laser beam pulse or bite and n is the number of laser bites, and wherein the % Δ

R per laser bite is substantially constant over an extended range of values of trim ratio (TR) for a film resistor network of given physical dimensions and having a given value of initial resistance.

10. A film resistor network geometry according to claim 9 wherein said film resistor is encapsulated in an impervious protective coating and terminals are mechanically and electrically connected to the film conductor electrodes.

11. A film resistor network geometry according to claim 9 wherein there are a plurality of similarly shaped electrically isolated individual film resistor networks formed on a single substrate and interconnected in a multiple component resistor network by appropriate interconnecting film conductors formed on said substrate along with said film resistor networks.

12. A film resistor network geometry according to claim 11 wherein said film resistor networks and interconnecting conductors are encapsulated in an impervious protective coating and terminals are mechanically and electrically connected to respective ones of the film conductor electrodes.

13. A film resistor network geometry according to claim 11 further including a lid comprised by an additional substrate member disposed over the film resistor networks and interconnecting film conductor covered surface of the first mentioned substrate in the manner of a sandwich and terminals mechanically and electrically connected to respective ones of the film conductor electrodes of the film resistor networks.

14. A new and improved method of manufacture and trimming film resistor networks having improved horizontal geometry comprising forming on a substrate at least one film resistor having a pair of opposed film conductor electrodes disposed on opposite sides of the film resistor with the film resistor comprising a tapered lower region adjoining a dome-shaped top region, the side edge intercepts of the film resistor engaged by the film conductor electrodes flaring outwardly from the bottom edge of the film resistor at least on one side thereof to form the tapered lower region, said film conductor electrodes terminating at the juncture of the tapered lower region with the dome-shaped top region whereby the dome-shaped top region is not engaged by the film conductor electrodes, and trimming the film resistor network thus formed with a laser beam by cutting a fine slit notch completely through the film resistor starting from the bottom edge thereof along a line substantially centered under the apex of the dome-shaped top whereby a substantially constant rate of change of resistance with trimming is achieved from start to finish, an extended trim ratio is obtained and the mean length of the effective resistor path is increased with increased trim depth.

15. The method of claim 14 wherein a computer controlled pulsed laser cutting beam is employed to provide the substantially constant rate of change of resistance with trimming by providing substantially equal laser beam cutting bites from the film resistor both at the beginning and for the full depth of the laser beam cut trimming notch.

16. The method according to claim 15 wherein the dome-shaped top region of the film resistor has an elongated semi-elliptical configuration.

17. The method according to claim 15 wherein the film resistor possesses a trim ratio (TR) characteristic in accordance with the expression:

space="preserve" listing-type="equation">TR=(1+% Δ

R/laser bite).sup.n

where % Δ

R/laser bite represents the change in resistance of the film resistor produced by each cutting laser beam pulse or bite and n is the number of laser bites, and wherein the % Δ

R per laser bite is substantially constant over an extended range of values of trim ratio (TR) for a film resistor network of given physical dimensions and having a given value of initial resistance.

18. The method according to claim 14 wherein the outwardly flaring side edge intercepts of the film resistor lie within a region having an outer limit defined by the expression X_l =mw+b and an inner limit defined by the expression X_l =(1+K)^w -1+b where X_l is the coordinate of the side edge intercept along the length of the film resistor geometry (abscissa) and w is the coordinate along the width (ordinate), m is the slope of the essentially straight line outer limit and b and K are constants determined by the desired starting geometry of the film resistor network as dictated by space constraints on the substrate.

19. The method according to claim 18 wherein the dome-shaped top region of the film resistor has an elongated semi-elliptical configuration.

20. The method according to claim 19 wherein the film resistor possesses a trim ratio (TR) characteristic in accordance with the expression:

space="preserve" listing-type="equation">TR=(1+% Δ

R/laser bite).sup.n

where % Δ

R/laser bite represents the change in resistance of the film resistor produced by each cutting laser beam pulse or bite and n is the number of laser bites, and wherein the % Δ

R per laser bite is substantially constant over an extended range of values of trim ratio (TR) for a film resistor network of given physical dimensions and having a given value of initial resistance.

21. The method according to claim 20 further comprising mechanically connecting terminals to respective ones of the film conductor electrodes, soldering the terminals to the film conductor electrodes to which they are connected, coating the film resistor network with an impervious protective coating, and curing the protective coating.

22. The method according to claim 20 wherein a plurality of similarly shaped electrically isolated individual film resistor networks are formed on a single substrate and interconnected in a multiple component resistor network by appropriate interconnecting film conductors formed on the same substrate along with said film resistor networks.

23. The method according to claim 22 further comprising mechanically connecting terminals to respective ones of the film conductor electrodes to which they are connected, coating the film resistor network with an impervious protective coating, and curing the protective coating.

24. The method according to claim 22 further comprising mechanically connecting terminals to respective ones of the film conductor electrodes, soldering the terminals to the film electrodes and applying an additional substrate member over the film resistor networks and interconnecting film conductors by means of a suitable adhesive.

25. The product of the method of manufacture according to claim 14.

26. The product of the method of manufacture according to claim 18.

27. The product of the method of manufacture according to claim 20.

28. The product of the method of manufacture according to claim 21.

29. The product of the method of manufacture according to claim 23.

30. The product of the method of manufacture according to claim 24.