Optically coupled isolator device and method of making same

• US 4,160,308 A
• Filed: 04/27/1978
• Issued: 07/10/1979
• Est. Priority Date: 02/02/1976
• Status: Expired due to Term

• Current Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Original Assignee: Fairchild Camera and Instrument Corporation
• Inventors: Lumba, Vijay K., Courtney, Thomas
• Primary Examiner(s): Tupman, W.
• Application Number:
  US05/900,685
• Time in Patent Office: 439 Days
• Field of Search: 29/576 S, 29/576 J, 29/588, 29/589, 29/590, 357/19, 250/551, 250/552
• US Class Current: 438/25
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/16 the semiconductor device sensitive to radiation being controlled by the light source or sources

Abstract

An improved optically coupled isolator uses a glass layer in combination with layers of junction coat material between the emitter and detector to provide greater electrical isolation while preventing potential ionic contamination in the glass from reaching the detector and causing a deterioration in its operating characteristics. The isolator is assembled using standard semiconductor processing techniques so that the cost of manufacture is not substantially increased.

Claims

1. A method of increasing the capability of an optically coupled isolator to withstand high voltage stresses applied thereto, the steps comprising:

forming a plurality of sets of electrically conductive leads;

attaching a semiconductor light detector to a lead in one set and a semiconductor light emitter to a lead in another set;

attaching electrically conductive wires between the detector and leads in the set in which the detector is attached;

attaching electrically conductive wires between the emitter and leads in the set in which the emitter is attached;

applying a first layer of junction coat material over the exposed portion of the detector including over locations where the wires are attached to the detector;

heating the first layer until it hardens;

applying a second layer of junction coat material over the first layer;

placing a layer of glass on the second layer;

heating a second layer until it hardens;

placing the set of leads containing the emitter over the set of leads containing the detector so that the emitter faces the detector across a space therebetween;

applying a third layer of junction coat material in the space between the glass and the emitter; and

,

heating the third layer until it hardens.

2. The method of claim 1 further defined by the additional step, after the step of heating the third layer, of encapsulating the structure with a moulding compound.