×

Temperature compensated piezoresistive transducer

  • US 4,166,269 A
  • Filed: 03/06/1978
  • Issued: 08/28/1979
  • Est. Priority Date: 03/06/1978
  • Status: Expired due to Term
First Claim
Patent Images

1. A temperature compensated piezoresistive transducer comprising,a semiconductor body having a major top surface and a bottom surface, said body having generally parallel spaced first and second elongate slots formed therein extending through said top and bottom surfaces to define a center portion extending between said elongate slots and first and second outer portions extending from the outward edge respectively of each of said elongate slots, said center portion being adapted to receive pressure to be measured, said body having two additional opposing U-shaped slots extending through said top and bottom surfaces and extending around said first, second and center portions to define the outer periphery of a transducer membrane with portions of said body between said U-shaped slots remaining to integrally support the membrane,at least four piezoresistive elements having elongate and transverse dimensions formed on said membrane, said piezoresistive elements being arrayed to receive compressive and tensile stress when pressure is applied and being connected as arms of a piezoresistive transducer bridge in which two opposing arms of the bridge are constituted by two of said piezoresistive elements which experience compression when a force is applied to the center portion of said membrane and in which the other two opposing arms of the bridge are constituted by the remaining two of said piezoresistive elements which experience tension when said force is applied to said center portion, all of said four piezoresistive elements having their elongate dimensions parallel to each other.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×