Transparent, electrically conductive laminated structure and process for production thereof

• US 4,166,876 A
• Filed: 03/23/1978
• Issued: 09/04/1979
• Est. Priority Date: 03/28/1977
• Status: Expired due to Term

• Current Assignee: Teijin Limited
• Original Assignee: Teijin Limited
• Inventors: Chiba, Kiyoshi, Itoh, Kunio, Mitani, Yuji, Yonemura, Utami, Sobajima, Shigenobu
• Primary Examiner(s): Robinson, Ellis P.
• Application Number:
  US05/889,450
• Time in Patent Office: 530 Days
• Field of Search: 428/470, 428/472, 428/480, 428/216, 428/215, 428/411, 428/412, 428/523, 428/421, 428/477.7, 428/425, 428/473.5, 428/539, 427/109, 427/108, 427/126, 427/164, 427/166, 427/407 G, 427/419 B, 427/404, 427/374 R
• US Class Current: 428/215
• CPC Class Codes: B60S 1/026 using electrical means
• CPC Class Codes: F24S 80/52 characterised by the material for preventing heat loss F24S80/56
• CPC Class Codes: F24S 80/56 characterised by means for preventing heat loss
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: Y02B 10/20 Solar thermal
• CPC Class Codes: Y02E 10/40 Solar thermal energy, e.g. solar towers
• CPC Class Codes: Y10T 428/24967 Absolute thicknesses specified
• CPC Class Codes: Y10T 428/24975 No layer or component greater than 5 mils thick
• CPC Class Codes: Y10T 428/31507 Of polycarbonate
• CPC Class Codes: Y10T 428/3154 Of fluorinated addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31609 Particulate metal or metal compound-containing
• CPC Class Codes: Y10T 428/31765 Inorganic-containing or next to inorganic-containing
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]
• CPC Class Codes: Y10T 428/31938 Polymer of monoethylenically unsaturated hydrocarbon

Abstract

A transparent, electrically conductive laminated structure composed of

(A) a transparent solid substrate,

(B) a thin layer of an oxide of titanium being contacted with the said substrate (A),

(c) a thin layer of an electrically conductive metal being contacted with the said layer (B),

(d) a thin layer of an oxide of titanium being contacted with the said layer (C), and

(E) optionally, a transparent top layer being contacted with the said layer (D)

characterized in that

(i) the said substrate (A) is a film-forming synthetic resin layer and

(ii) the said layer (B) is a layer of an oxide of titanium derived from a layer of an organic titanium compound and contains organic residual moieties of the said organic titanium compound;

And a process for the production of the same.

Claims

1. A transparent, electrically conductive laminated structure comprising:

(A) a transparent solid substrate,

(B) a thin layer of an oxide of titanium in contact with the said substrate,

(C) a thin layer of an electrically conductive metal in contact with the said layer (B),

(d) a thin layer of an oxide of titanium in contact with the said layer (C), and

(E) with or without a transparent top layer in contact with the said layer (D), wherein;

(i) the said substrate (A) is a film-forming synthetic resin layer and

(ii) the said layer (B) is a layer of an oxide of titanium derived from a layer of an organic titanium compound and contains organic residual moieties of the said organic titanium compound, the amount of said organic residual moieties being 0.1-30% by weight based on the weight of the said layer (B).

2. A laminated structure described in claim 1 in which (iii) the said layer (D) is a layer of an oxide of titanium derived from a layer of an organic titanium compound and contains organic residual moieties of the said organic titanium compound.

3. A laminated structure described in claim 1 in which the layer having the said organic residual moiety is a layer of an oxide of titanium derived from a layer of alkyl titanate having C₁ -C₂₀ alkyl groups.

4. A laminated structure described in claim 1 in which the metal of the said layer (C) is at least one member of metals selected from the group consisting of Ag and Cu.

5. A laminated structure described in claim 4 in which the metal of the said layer (C) consists of Ag and Cu with the content of the said Cu being 1-30% by weight based on the total of Ag and Cu.

6. A laminated structure described in claim 1 in which the said substrate (A) is a polyester layer which is 80% or more in the visible light transparency and 6-250 μ

m in film thickness.

7. A laminated structure described in claim 1 in which the said layer (B) is 50-1000 A in film thickness.

8. A laminated structure described in claim 1 in which the said layer (C) is 50-600 A in film thickness.

9. A laminated structure described in claim 1 in which the said layer (D) is 50-1000 A in film thickness.

10. A process for the production of a transparent, electrically conductive laminated structure described in claim 1 which comprises following steps (1)-(4):

(1) Coating the surface of a transparent solid substrate of a film-forming resin with a solution of an organic titanium compound in solvent;

(2) Drying the said coated layer obtained in the said step (1) in such a manner as to hydrolyze a part of the organic moieties of the organic titanium compounds the amount of residual moieties being 0.1 to 30% by weight based on the weight of the dried coated layer;

(3) Forming a thin layer of an electrically conductive metal on the said dried layer of the oxide of titanium containing organic residual moieties formed in the said step (2);

(4) Forming a layer of an oxide of titanium on the said thin layer of the electrically conductive metal formed in the said step (3), with or without

(5) Forming a transparent top layer on the said layer obtained in the said step (4), and

said film forming resin of step (1) being capable of withstanding the drying temperature of step (2).

11. A process described in claim 10 in which the said step (4) is conducted by similar means to that of the said step (1) and step (2).