Arrangement for photographic data marking

• US 4,168,894 A
• Filed: 09/19/1977
• Issued: 09/25/1979
• Est. Priority Date: 10/28/1976
• Status: Expired due to Term

• Current Assignee: Oerlikon Contraves AG (Rheinmetall AG)
• Original Assignee: Contraves AG (Rheinmetall AG)
• Inventors: Adolph, Peter
• Primary Examiner(s): Adams, Russell E.
• Application Number:
  US05/834,816
• Time in Patent Office: 736 Days
• Field of Search: 354/105, 354/109
• US Class Current: 396/318
• CPC Class Codes: G03B 17/24 with means for separately producing marks on the film, e.g. title, time of exposure
• CPC Class Codes: G03B 2217/243 Optical devices
• CPC Class Codes: G06K 1/126 by photographic or thermographic registration recording apparatus for measuring instruments G01D15/00

Abstract

An arrangement for photographic data marking upon a film strip passing through a photographic camera, especially a high-speed theodolite camera, while utilizing a perforated mask and luminescent diodes carried by a substrate. In accordance with the invention, the arrangement is structured as an integrated component which contains at least the substrate, the semiconductor bodies of the luminescent diodes, the perforated mask and a transparent cover plate. The perforated mask is fixedly connected at the side confronting the film strip with the inner side or face of the cover plate. The semiconductor bodies which are electrically connected by electrical connections with one another and with the substrate are arranged at a slight spacing from the other side or face of the perforated mask.

Claims

1. An arrangement for photographic data marking upon a film strip passing intermittently through a photographic camera, such as a high-speed theodolite camera, comprising:

a perforated mask;

a glass mask;

luminescent diodes supported by a substrate;

said arrangement being structured as an integrated component filled with an inert gas and hermetically sealed;

said arrangement containing at least the substrate, semiconductor bodies of the luminescent diodes, the perforated mask, and the glass mask;

wherein one side of the perforated mask is fixedly connected with the inside of the glass mask;

wherein the semiconductor bodies, which are connected with one another by means of electrical lines as well as with the substrate, are arranged at a spacing from the other side of the perforated mask, said spacing is in the order of magnitude of about 0.2 to 0.6 mm;

said perforated mask possesses openings;

said other side of the perforated mask confronts the semiconductor bodies of the luminescent diodes; and

wherein all surfaces defining said openings of the perforated mask possess light-absorbing properties whereby a reflection of the light rays is prevented and a refraction of the light rays of beams within neighboring openings is avoided.

2. The arrangement as defined in claim 1, further comprising:

a coating equipped with openings confronting window means, in confrontation with the film strip, for passing of light therethrough, for limiting the contour of the light spot emitted by the luminescent diodes, and for reducing the reflection of the light.