Bright electroless plating process and plated articles produced thereby

• US 4,169,171 A
• Filed: 02/13/1978
• Issued: 09/25/1979
• Est. Priority Date: 11/07/1977
• Status: Expired due to Term

• Current Assignee: Enthone Incorporated (Element Solutions Inc)
• Original Assignee: Harold Narcus
• Inventors: Narcus, Harold
• Primary Examiner(s): Smith, John D.
• Application Number:
  US05/876,895
• Time in Patent Office: 589 Days
• Field of Search: 427/430 A, 427/437, 427/438, 427/304-306, 427/404, 427/264, 427/307
• US Class Current: 427/264
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C23C 18/2086 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/36 using hypophosphites
• CPC Class Codes: H05K 3/244 Finish plating of conductors, especially of copper conductors, e.g. for pads or lands selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3457, e.g. by plating H05K3/3473
• CPC Class Codes: Y10S 428/936 Chemical deposition, e.g. electroless plating

Abstract

An adherent bright metallic coating which may be any metal or alloy capable of being deposited electrolessly, is applied to the surface of a plastic or other dielectric part (or to a metal part) by an electroless process comprising suitable pretreatment of said surface, deposition of a primary electroless copper to produce an underlayer, then depositing a bright secondary electroless coating of the desired metal (the overlayer) with complete elimination of any subsequent electroplating process [usually required to achieve this brightness]. The required overlayer may also be limited to selected surface areas of a coated part by mechanically removing portions of the primary electroless copper prior to immersion of the part in the secondary electroless bath to produce the desired overlayer metal.

Claims

1. Method of electroless metal coating to produce a bright metal of high reflectivity and adhesion comprising,

treating a substrate surface to prepare it for electroless coating,

then treating the entirety of said surface with a primary electroless copper coating solution maintained at a basic pH of 11.5-13.5 and containing a copper chelating agent,

and coating the surface with copper at 0.2-0.4 mils per hour,

then treating the said surface with a secondary electroless metal coating solution maintained at its characteristic electroless coating pH,

the secondary solution comprising sufficient phosphorus and being controlled to produce 6-12 weight percent phosphorus in the final coating produced from the secondary coating solution.

2. The method of claim 1 wherein the overlayer coating solutions contain AH₂ PO₂.H₂ O where A is selected from the class consisting of alkali metal and ammonium ions.

3. The method of claim 1 wherein a portion of the primary copper layer is removed prior to treating the primary nickel coated substrate with the secondary electroless coating solution.

4. The method of claim 1 wherein both primary and secondary treating steps comprise immersion of the substrate.

5. The method of claim 1 wherein the substrate preparation treatment comprises etching, catalyst deposition for activation and acceleration by surface attack.

6. Method of nickel coating comprising,

etching and activating the surface of one or more substrate articles in a single step,

acceleration treatment of the substrate surfaces,

immersing of the substrates in a primary copper solution maintained at 25°

-35°

C. and pH of 11.5-13.5 for 5-15 minutes to produce a primary copper coating thereon at 0.2-0.4 mils per hour,

and then immersing the substrate without rinsing or neutralization, into a secondary electroless metal coating solution maintained at temperature and pH to produce a self building brightening of the surfaces,

the secondary solution comprising sufficient phosphorus and being controlled to produce 6-12 weight percent phosphorus in the final coating produced from the secondary coating solution.

7. Method of nickel coating in accordance with claim 6 wherein a portion of the primary coating is removed prior to the said second immersion of the substrates into nickel solution.

8. Method in accordance with claim 6 wherein said primary copper solution comprises copper sulfate

and a basic mixture including glacial acetic acid and ammonium hydroxide and said secondary metal solution comprises sulphate salt of the metal, sodium hypophosphite and a weak acid mixture.

9. Method of electroless metal coating to produce a bright metal of high reflectivity and adhesion comprising,

treating a nonconductive substrate to prepare it for electroless coating,

then applying a primary copper underlayer to the substrate by simultaneous reduction of a copper compound while dissolved in an electroless bath in contact with the substrate while chelating copper ions therein and at a rate of 0.2-0.4 mils per hour,

then applying a secondary metal coating to the said copper surfaced substrate by electroless coating,

the secondary solution comprising sufficient phosphorus and being controlled to produce 6-12 weight percent phosphorus in the final coating produced from the secondary coating solution.

10. The method of claim 9 wherein the primary electroless coating utilizes an organic reducing agent compound having multiple bonds.